Driving device of micropump and microvalve, and microfludic device using same

ABSTRACT

A driving device of a micropump and a microvalve is provided. The driving device comprises a pump driver controlled by a pump controller, a valve driver controlled by a valve controller, a power supply part, a switch part. The pump driver having a first shape memory alloy wire, a micropump of the first shape memory alloy wire, a wiring part arranged in parallel to the first shape memory alloy wire, and a first selector switch that switches between a state where only the first shape memory alloy wire is energizable and a state where the wiring part is energizable. The valve driver having a plurality of second shape memory alloy wires, a plurality of microvalves of second shape memory alloy wires, and a second selector switch that brings into a state where one of the plurality of second shape memory alloy wires is energizable.

RELATED APPLICATIONS

This application is the Divisional Application of U.S. patent application Ser. No. 14/633,532, filed on Feb. 27, 2015, which in turn claims the benefit of Japanese Application No. 2014-046516, filed on Mar. 10, 2014, the disclosures of which applications are incorporated by reference herein.

BACKGROUND

1. Technical Field

The present disclosure relates to a driving device of a micropump and a microvalve capable of easily realizing control of pump displacement and reducing loss by energizing a shape memory alloy for pump driving only during energizing a shape memory alloy for valve driving arranged in series, in a microfluidic device that drives a pump or a valve, using the shape memory alloy, and a microfluidic device using the driving device.

2. Description of the Related Art

There has been known a microfluidic device as a device that creates a minute flow channel, a reactor vessel, or the like, using fine processing technologies such as a micromachining technology, and that conducts chemical analysis, chemical synthesis, bio experiment or the like. The microfluidic device is also called a μ-TAS or a Labo on a chip, and has been developed. Ordinarily, in the microfluidic device, a supplied liquid such as blood is sent to a reactor provided on the device to perform thermal or chemical reaction processing. Thereafter, the liquid after reaction processing is sent to a detector provided on the device, and a result of the reaction is determined to thereby evaluate the supplied liquid. Therefore, in the microfluidic device, the micropump or the microvalve to control a flow of the liquid is required. As one method of the micropump or the microvalve, there has been a method of deforming a diaphragm provided in the microfluidic device. The diaphragm, when being deformed to push a flow channel, comes to serve as the valve. Moreover, by using a check valve and volume change accompanying reciprocation displacement of the diaphragm, a so-called diaphragm type pump can be configured. For a method for deforming the diaphragm, there have been proposed methods using various actuators such as a piezoelectric actuator, a static actuator, and an electromagnetic actuator, because the actuator to be driven can be freely selected. As one type of the above-described micropump or microvalve, there has been proposed a diaphragm type micropump or microvalve using a shape memory alloy actuator (e.g., refer to PTL 1 and PTL 2). The shape memory alloy actuator uses a phenomenon in which a wire-like shape memory alloy contracts by temperature rise due to energization heating, and extends to an original length by temperature drop due to natural heat dissipation. Using the shape memory alloy actuator enables a micropump or microvalve compact in sizes in directions other than a displacement direction to be configured, which allows the plurality of micropumps or microvalves to be easily arranged on the microfluidic device.

SUMMARY

According to a first aspect of the present disclosure, there is provided a driving device of a micropump and a microvalve including:

a pump driver having a first shape memory alloy wire, a micropump that performs pump operation with extension and contraction of the first shape memory alloy wire, a short-circuit wiring part arranged in parallel to the first shape memory alloy wire, and a first selector switch that switches between a state where only the first shape memory alloy wire is energizable and a state where the short-circuit wiring part is energizable;

a valve driver having a plurality of second shape memory alloy wires, a plurality of microvalves that perform valve operation with extension and contraction of the respective plurality of second shape memory alloy wires, and a second selector switch that brings into a state where one of the plurality of second shape memory alloy wires is energizable;

a power supply part;

a switch part that is connected to the pump driver and the valve driver in series, and turns on and off a current flowing through the pump driver and the valve driver from the power supply part;

a valve controller that controls a state of the second selector switch and frequency of on and off of the switch part; and

a pump controller that controls a period when the first selector switch enters the state where only the first shape memory alloy wire is energizable, when the switch part is in an on state.

General and specific aspects of the foregoing may be realized by systems and methods, and arbitrary combination of the systems and the methods.

According to the above-described aspect of the present disclosure, only when the shape memory alloy wires for microvalve driving are energized, the shape memory alloy wire for micropump driving is energized. Thus, in contrast to the microvalves of on and off operation, during the driving of the micropump requiring volume control, the shape memory alloy wire for micropump operation is driven at the voltage of the power supply part divided by resistances of the shape memory alloy wires for microvalve operation. As a result, the control of the pump volume becomes easy. Moreover, since the voltage division is realized by the resistance of the shape memory alloy wire corresponding to the driven microvalve, wasteful loss is not caused. Thus, the driving device of the micropump and the microvalve capable of easily realizing the control of the pump volume and reducing loss can be attained.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a diagram showing an outline of a fluid conveyance device in a first embodiment of the present disclosure;

FIG. 2 is a front diagram showing an outline of a driving mechanism in an extended state, the driving mechanism using a shape memory alloy wire that drives each of a micropump and a microvalve in the first embodiment of the present disclosure;

FIG. 3 is a front diagram showing an outline of the driving mechanism in a contracted state, the driving mechanism using the shape memory alloy wire that drives each of the micropump and the microvalve in the first embodiment of the present disclosure;

FIG. 4 is a diagram showing an outline of a microfluidic device using the fluid conveyance device in the first embodiment of the present disclosure;

FIG. 5 is a timing chart of operation of the microfluidic device using the fluid conveyance device in the first embodiment of the present disclosure;

FIG. 6 is a diagram showing a timing chart indicating an energization state during driving the micropump and the microvalves in the first embodiment of the present disclosure;

FIG. 7 is a diagram showing an outline of a fluid conveyance device in a second embodiment of the present disclosure;

FIG. 8 is a diagram showing an outline of a microfluidic device using the fluid conveyance device in the second embodiment of the present disclosure;

FIG. 9 is a timing chart of operation of the microfluidic device using the fluid conveyance device in the second embodiment of the present disclosure;

FIG. 10 is a diagram showing a timing chart indicating an energization state during driving a micropump and microvalves in the second embodiment of the present disclosure;

FIG. 11 is a diagram showing an outline of a fluid conveyance device in a third embodiment of the present disclosure;

FIG. 12 is a diagram showing an outline of a microfluidic device using the fluid conveyance device in the third embodiment of the present disclosure;

FIG. 13 is a timing chart of operation of the microfluidic device using the fluid conveyance device in the third embodiment of the present disclosure;

FIG. 14 is a diagram showing a timing chart indicating an energization state during driving micropumps and microvalves in the third embodiment of the present disclosure;

FIG. 15 is a diagram showing an outline of a fluid conveyance device in a fourth embodiment of the present disclosure;

FIG. 16 is a diagram showing an outline of a microfluidic device using the fluid conveyance device in the fourth embodiment of the present disclosure;

FIG. 17 is a timing chart of operation of the microfluidic device using the fluid conveyance device in the fourth embodiment of the present disclosure;

FIG. 18 is a diagram showing a timing chart indicating an energization state during driving micropumps and microvalves in the fourth embodiment of the present disclosure; and

FIG. 19 is a diagram showing an outline of a fluid conveyance device in a modification of the fourth embodiment of the present disclosure.

DETAILED DESCRIPTION OF THE EMBODIMENTS

The actuator using the wire-like shape memory alloy can generate a deformation of about 4%. Accordingly, in the micropump or the microvalve, as a length of the shape memory alloy required for displacing the diaphragm by about 0.1 mm, 10 mm suffices even if a margin is given in view of a life or the like. A resistance of the shape memory alloy is about 61 Ω/m in the case of a wire having a diameter of 150 μm, and thus, the resistance is about 0.61Ω in the case of the wire having the length of 10 mm. Moreover, a standard current in subjecting the shape memory alloy wire to energization heating is about 340 mA, and if a current exceeding this continues to be applied, a temperature of the shape memory alloy rises too much, which leads to deterioration in performance. From the resistance value and the standard current, a standard voltage in subjecting the shape memory alloy wire having the length of 10 mm to energization heating is only about 0.21 V, so that an applied electric power is 71 mW.

On the other hand, for adjustment of the applied electric power to the shape memory alloy actuator, PWM (Pulse Width Modulation) control is ordinarily used. The PWM control allows the shape memory alloy actuator to be intermittently energized. That is, adjusting energization time enables the applied electric power to the shape memory alloy actuator to be controlled while keeping a power supply voltage constant. Thus, a displacement amount of the shape memory alloy actuator linked with the temperature of the shape memory alloy can be controlled. However, in the case where the energization heating of the shape memory alloy wire having the length of 10 mm is subjected to PWM control by using the power supply of 1 V, in order to obtain the applied electric power equivalent to the continuous energization of 0.21 V, a duty ratio is required to be 4.4%, and as large as a current of 1.6 A is caused to instantaneously flow. Thus, in order to adjust the applied electric power to the shape memory alloy actuator and control a pump volume, a PWM control system having a sufficient resolution in a duty ratio range of 0% to 4.4% inclusive needs to be constructed. Further, since the current is large, influence by an internal resistance on loss in a driving circuit cannot be neglected. Accordingly, even though the PWM control is simply performed, high precision, coping with the large current, and reduction of loss have been demanded to the circuit, which makes circuit manufacturing difficult. The foregoing poses a problem that the control of the pump volume, which varies accompanying the displacement of the shape memory alloy actuator, cannot be easily realized.

As a method for making the circuit manufacturing easy against the above-described problem, it is considered to connect a resistor in series to the shape memory alloy wire. By the resistor, the voltage applied to the shape memory alloy wire becomes a divided voltage of the power supply voltage. When the resistor of 2.2Ω is connected in series, the voltage applied to the shape memory alloy wire is reduced to 0.22 V with respect to the power supply voltage of 1 V. In this case, most of the adjustment range of the duty ratio in the PWM control becomes available, and the current can also be reduced. This makes easier not only the circuit manufacturing but control of the pump volume. However, since nearly 80% of the applied electric power is lost in the resistor, there is a problem in efficiency.

Hereinafter, referring to the drawings, embodiments according to the present disclosure will be described in detail.

Before describing the embodiments of the present disclosure, various aspects of the present disclosure will be described.

According to a first aspect of the present disclosure, there is provided a driving device of a micropump and a microvalve including:

a pump driver having a first shape memory alloy wire, a micropump that performs pump operation with extension and contraction of the first shape memory alloy wire, a short-circuit wiring part arranged in parallel to the first shape memory alloy wire, and a first selector switch that switches between a state where only the first shape memory alloy wire is energizable and a state where the short-circuit wiring part is energizable;

a valve driver having a plurality of second shape memory alloy wires, a plurality of microvalves that perform valve operation with extension and contraction of the respective plurality of second shape memory alloy wires, and a second selector switch that brings into a state where one of the plurality of second shape memory alloy wires is energizable;

a power supply part;

a switch part that is connected to the pump driver and the valve driver in series, and turns on and off a current flowing through the pump driver and the valve driver from the power supply part;

a valve controller that controls a state of the second selector switch and frequency of on and off of the switch part; and

a pump controller that controls a period when the first selector switch enters the state where only the first shape memory alloy wire is energizable, when the switch part is in an on state.

According to the above-described configuration, only when the shape memory alloy wires for microvalve driving are energized, the shape memory alloy wire for micropump driving is energized. Thus, in contrast to the microvalves of on and off operation, during the driving of the micropump requiring volume control, the shape memory alloy wire for micropump operation is driven at the voltage of the power supply part divided by resistances of the shape memory alloy wires for microvalve operation. As a result, the control of the pump volume becomes easy. Moreover, since the voltage division is realized by the resistance of the shape memory alloy wire corresponding to the driven microvalve, wasteful loss is not caused. Thus, the driving device of the micropump and the microvalve capable of easily realizing the control of the pump volume and reducing loss can be attained.

According to a second aspect of the present disclosure, provided is the driving device of the micropump and the microvalve according to the first aspect, including the plurality of valve drivers,

wherein the plurality of valve drivers are connected in series.

According to the above-described configuration, in a state where the plurality of microvalves are simultaneously driven, the voltage applied to the shape memory alloy wire for micropump driving can be further reduced, so that the driving device of the micropump and the microvalve capable of easily realizing the control of the pump volume can be attained.

According to a third aspect of the present disclosure, provided is the driving device of the micropump and the microvalve according to the first aspect or the second aspect,

wherein the pump driver has the plurality of first shape memory alloy wires and the plurality of micropumps, and

the first selector switch switches to a state where one of the plurality of first shape memory alloy wires or the short-circuit wiring part is energizable.

According to the above-described configuration, in the state where the plurality of micropumps are selectively driven as well, the driving device of the micropump and the microvalve capable of easily realizing the control of the pump volume and reducing loss can be attained.

According to a fourth aspect of the present disclosure, provided is the driving device of the micropump and the microvalve according to any one of the first to third aspects, including the plurality of pump drivers,

wherein the plurality of pump drivers are connected in series.

According to the above-described configuration, in a state where the plurality of micropumps are constantly driven simultaneously, the driving device of the micropump and the microvalve capable of easily realizing the control of the pump volume and reducing loss can be attained.

According to a fifth aspect of the present disclosure, provided is the driving device of the micropump and the microvalve according to the fourth aspect,

wherein each of the pump drivers has a resistor wiring part in parallel to the first shape memory alloy wire, and

each of the first selector switches can also switch to a state where only the resistor wiring part is energizable.

According to the above-described configuration, even when the one of the shape memory alloy wires for micropump driving is not energized, fluctuations of the voltage applied to the other micropump or the microvalve connected in series can be suppressed. Thus, in the state where the plurality of micropumps are driven simultaneously or individually as well, the driving device of the micropump and the microvalve capable of easily realizing the control of the pump volume and reducing loss can be attained.

According to a sixth aspect of the present disclosure, provided is the driving device of the micropump and the microvalve according to any one of the first to third aspects, wherein the valve controller adjusts frequency of on and off of the switch part in accordance with a period when the pump controller brings into the state where only the first shape memory alloy wire is energizable.

According to the above-described configuration, as energization time to the shape memory alloy wire for micropump driving is shorter, an electric power applied to the shape memory alloy wires for microvalve driving can be more prevented from increasing, so that the driving device of the micropump and the microvalve having less power consumption can be attained.

According to a seventh aspect of the present disclosure, there is provided a microfluidic device including:

the driving device of the micropump and the microvalve according to any one of the first to sixth aspects;

a liquid storage;

the micropump connected to the liquid storage;

the plurality of microvalves connected to the micropump; and

a discharger connected to at least one of the plurality of microvalves.

According to the above-described configuration, the microfluidic device including the driving device of the micropump and the microvalve according to any one of the first to sixth aspects can be configured, so that the microfluidic device that can exert the actions and the effects of the driving device of the micropump and the microvalve can be attained.

According to an eighth aspect of the present disclosure, there is a method for opening a micropump and a microvalve included in a driving device of the micropump and the microvalve, the method comprising:

(a) preparing the driving device of the micropump and the microvalve, the driving device comprising:

-   -   a first pump driver having a first shape memory alloy wire, a         first micropump that performs pump operation with extension and         contraction of the first shape memory alloy wire, a first wiring         part arranged in electrically parallel to the first shape memory         alloy wire, and a first selector switch that selects between a         state where only the first shape memory alloy wire is         electrically energizable and a state where the first wiring part         is electrically energizable;     -   a first valve driver having a plurality of second shape memory         alloy wires, a plurality of microvalves that perform valve         operation with extension and contraction of the respective         plurality of second shape memory alloy wires, and a second         selector switch that selects one electrically energizable second         shape memory alloy wire from among the plurality of the second         shape memory alloy wires;     -   a power supply part;     -   a switch part that is connected to the first pump driver and the         first valve driver in series, and turns on and off a current         flowing through the first pump driver and the first valve driver         from the power supply part;     -   a valve controller that controls a state of the second selector         switch and frequency of on and off of the switch part; and     -   a pump controller that controls a period when the first selector         switch enters the state where only the first shape memory alloy         wire is energizable, in a case where the switch part is in an on         state,

the method comprising:

(b) heating the first shape memory alloy wire and the selected one electrically energizable second shape memory alloy wire to open the micropump including the first shape memory alloy wire and to open the microvalve including the selected one electrically energizable second shape memory alloy wire by repeating the following steps (b1) and (b2):

-   -   (b1) applying a voltage supplied from the power supply part to         the first shape memory alloy wire and the one electrically         energizable second shape memory alloy wire selected through the         first selector switch and the second selector switch for given         time, respectively, to heat the first shape memory alloy wire         and the selected one electrically energizable second shape         memory alloy wire; and     -   (b2) applying the voltage supplied from the power supply part to         the wiring part and the one electrically energizable second         shape memory alloy wire selected through the first selector         switch and the second selector switch, respectively, to heat the         selected one electrically energizable second shape memory alloy         wire.

According to the above-described configuration, a fluid flows without losing the voltage wastefully.

According to a ninth aspect of the present disclosure, provided is the method according to the eighth aspect,

wherein the step (b) further comprises:

-   -   (b3) turning off the switch part after the step (b2) to turn off         the current flowing from the power supply part to the first pump         driver and the first valve driver; and     -   (b4) turning on the switch part after the step (b3) to turn on         the current flowing from the power supply part to the first pump         driver and the first valve driver, and in the step (b), the step         (b1), the step (b2), the step (b3) and the step (b4) are         repeated.

According to the above-described configuration, the fluid flows without losing the voltage wastefully.

According to a tenth aspect of the present disclosure, provided is the method according to the eighth aspect,

wherein the driving device of the micropump and the microvalve further comprises a second valve driver having a plurality of third shape memory alloy wires, a plurality of microvalves that perform valve operation with extension and contraction of the respective plurality of third shape memory alloy wires, and a third selector switch that selects one electrically energizable third shape memory alloy wire from among the plurality of the third shape memory alloy wires,

the second valve driver is connected to the first valve driver in series,

in the step (b1), the voltage supplied from the power supply part is applied to the selected one electrically energizable third shape memory alloy wire for given time to heat the selected one electrically energizable third shape memory alloy wire, and

in the step (b2) as well, the voltage supplied from the power supply part is applied to the selected one electrically energizable third shape memory alloy wire to heat the selected one electrically energizable third shape memory alloy wire.

According to the above-described configuration, the fluid flows without losing the voltage wastefully.

According to an eleventh aspect of the present disclosure, provided is the method according to the eighth aspect,

wherein the first pump driver further comprises a third shape memory alloy wire arranged in electrically parallel to the first shape memory alloy wire, and a third micropump that performs pump operation with extension and contraction of the third shape memory alloy wire,

the first selector switch switches among a state where only the first shape memory alloy wire is energizable, a state where only the third shape memory alloy wire is energizable, and a state where the first wiring part is energizable, and

in the step (b1), one of the first shape memory alloy wire and the third shape memory alloy wire is selected through the first selector switch, and the one of the second shape memory alloy wires is selected through the second selector switch to heat the selected shape memory alloy wires by applying the voltage supplied from the power supply part to the selected shape memory alloy wires for given time.

According to the above-described configuration, the fluid flows without losing the voltage wastefully.

According to a twelfth aspect of the present disclosure, provided is the method according to the eighth aspect,

wherein the driving device of the micropump and the microvalve further comprises a second pump driver having a third shape memory alloy wire, a third micropump that performs pump operation with extension and contraction of the third shape memory alloy wire, a second wiring part arranged in electrically parallel to the third shape memory alloy wire, and a third selector switch that switches between a state where only the third shape memory alloy wire is energizable, and a state where the second wiring part is energizable,

the second pump driver is connected to the first pump driver in series,

in the step (b1), the third shape memory alloy wire is selected through the third selector switch to heat the third shape memory alloy wire by applying the voltage supplied from the power supply part to the third shape memory alloy wire for given time, and

in the step (b2), the second wiring part is selected through the third selector switch.

According to the above-described configuration, the fluid flows without losing the voltage wastefully.

According to a thirteenth aspect of the present disclosure, provided is the method according to the twelfth aspect,

wherein the first pump driver further comprises a resistor arranged in electrically parallel to the first shape memory alloy wire,

the first selector switch switches among a state where only the first shape memory alloy wire is energizable, a state where only the resistor is energizable, and a state where the first wiring part is energizable,

the step (b1) further comprises the following steps (b11) and (b12):

-   -   (b11) selecting the first shape memory alloy wire, the one of         the second shape memory alloy wires and the third shape memory         alloy wire through the first selector switch, the second         selector switch, and the third selector switch, respectively, to         heat the first to third shape memory alloy wires by applying the         voltage supplied from the power supply part to the selected         first to third shape memory alloy wires for given time; and     -   (b12) selecting the resistor, the one of the second shape memory         alloy wires, and the third shape memory alloy wire through the         first selector switch, the second selector switch, and the third         selector switch, respectively, to heat the selected second and         third shape memory alloy wires by applying the voltage supplied         from the power supply part to the selected second and third         shape memory alloy wires for given time, and

in the step (b2), the first wiring part, the one of the second shape memory alloy wires, and the second wiring part are selected through the first selector switch, the second selector switch, and the third selector switch, respectively, to heat the selected second shape memory alloy wire by applying the voltage supplied from the power supply part to the selected second shape memory alloy wire for given time.

According to the above-described configuration, the fluid flows without losing the voltage wastefully.

According to a fourteenth aspect of the present disclosure, provided is the driving device of the micropump and the microvalve according to the first aspect, which is further operative to:

(a) heat the first shape memory alloy wire and the selected one electrically energizable second shape memory alloy wire to open the micropump including the first shape memory alloy wire and the microvalve including the selected one electrically energizable second shape memory alloy wire by repeating the following (b) and (c):

(b) apply a voltage from the power supply part to the first shape memory alloy wire and the one electrically energizable second shape memory alloy wire selected through the first selector switch and the second selector switch for given time, respectively, to heat the first shape memory alloy wire and the selected one electrically energizable second shape memory alloy wire; and

(c) apply the voltage from the power supply part to the wiring part and the one electrically energizable second shape memory alloy wire selected through the first selector switch and the second selector switch, respectively, to heat the selected one electrically energizable second shape memory alloy wire.

According to the above-described configuration, a fluid flows without losing the voltage wastefully.

Hereinafter, the driving device of the micropump and the microvalve, and the microfluidic device using the driving device according to embodiments of the present disclosure will be described with reference to the drawings.

First Embodiment <Configuration>

FIG. 1 shows an outline of fluid conveyance device 1 a functioning as one example of a driving device of a micropump and a microvalve in a first embodiment of the present disclosure.

Fluid conveyance device 1 a includes at least pump driver 7 a, valve driver 10 a, a power supply part, a switch part (on/off switch part), valve controller 11 a, and pump controller 12 a. In fluid conveyance device 1 a, the power supply part, the switch part, pump driver 7 a, and valve driver 10 a are connected in series.

Fluid conveyance device 1 a is driven by DC power supply 2 as one example of the power supply part. Only when switch circuit 3 as one example of the switch part connected to DC power supply 2 is on, a current flows in fluid conveyance device 1 a. At this time, the current from DC power supply 2 also flows through pump driver 7 a and valve driver 10 a, which are connected to switch circuit 3 in series.

Pump driver 7 a is made up of switching circuit 4 a as one example of a first selector switch, linear shape memory alloy wire 5 a as one example of a first shape memory alloy wire, and copper wire 6 a as one example of a short-circuit wiring part. A current from DC power supply 2 is configured to flow through either of shape memory alloy wire 5 a or copper wire 6 a selected by switching circuit 4 a. It is desirable in view of smaller resistance to use the copper wire as one example of the short-circuit wiring part. However, the present disclosure is not limited thereto, but another conductive material may be used to realize a short circuit of the short-circuit wiring part.

Valve driver 10 a is made up of switching circuit 8 a as one example of a second selector switch, and linear shape memory alloy wires 9 a, 9 b, 9 c, 9 d as examples of second shape memory alloy wires. The current from DC power supply 2 is configured to flow through any one of shape memory alloy wires 9 a, 9 b, 9 c, 9 d selected by switching circuit 8 a.

Though a detailed description will be given later, shape memory alloy wire 5 a in FIG. 1 is used to configure micropump 50 a, and shape memory alloy wires 9 a, 9 b, 9 c, 9 d are used to configure microvalves 51 a, by which fluid conveyance device 1 a functions as one example of a driving device of micropump 50 a and microvalves 51 a.

Valve controller 11 a as one example of the valve controller is configured to control operation of switch circuit 3 and switching circuit 8 a independently. Pump controller 12 a as one example of the pump controller is configured to control operation of switching circuit 4 a in accordance with an operation state of valve controller 11 a.

FIG. 2 shows an outline of a driving mechanism in an extended state, which driving mechanism uses shape memory alloy wire 5 a or shape memory alloy wires 9 a, 9 b, 9 c, 9 d that drive micropump 50 a or microvalves 51 a in the first embodiment of the present disclosure. FIG. 3 shows an outline of the driving mechanism in a contracted state, which driving mechanism uses shape memory alloy wire 5 a or shape memory alloy wires 9 a, 9 b, 9 c, 9 d that drive micropump 50 a or microvalves 51 a in the first embodiment of the present disclosure. In the driving mechanism in FIGS. 2 and 3, as a representative example of shape memory alloy wire 5 a or shape memory alloy wires 9 a, 9 b, 9 c, 9 d, shape memory alloy wire 21 will be described. This driving mechanism can function as micropump 50 a or microvalve 51 a. This driving mechanism also functions as each micropump or each microvalve according to embodiments described later.

Shape memory alloy wire 21 is held by holding member 22 at one end (an upper end in FIGS. 2 and 3), and is held by pressing member 23 at another end (a lower end in FIGS. 2 and 3). Wiring 24 is also held by holding member 22, and shape memory alloy wire 21 and wiring 24 are electrically connected inside holding member 22. Wiring 25 is also held by pressing member 23, and shape memory alloy wire 21 and wiring 25 are electrically connected inside pressing member 23.

Holding member 22 is joined to an inside of through-hole 27 a of fixed plate 27 to be fitted and fixed, and is thereby fixed to fixed plate 27 along a surface of fixed plate 27 so as not to be displaced (in a right-left direction in FIGS. 2 and 3). Compression spring 26 is disposed in a compressed state between fixed plate 27 and pressing member 23 with shape memory alloy wire 21 linearly penetrating a central portion of compression spring 26. Thus, compression spring 26 is configured to apply a tension in an extension direction to shape memory alloy wire 21 by a biasing force of compression spring 26.

End portion 23 a having a small diameter of pressing member 23 is fitted and disposed so as to be able to freely perform reciprocation operation inside hole 31 provided in pressure plate 28 disposed, for example, parallel to fixed plate 27. End portion 23 a of pressing member 23 can reciprocate between a projection position where end portion 23 a projects from hole 31 of pressure plate 28, and a withdrawal position where end portion 23 a is withdrawn inside hole 31 of pressure plate 28.

Pressure plate 28 and fixed plate 27 are restrained lest mutual relative positions should change. Moreover, pressure plate 28 is fixed such that an outer surface thereof (a lower surface in FIGS. 2 and 3) pushes flow channel substrate 29 through resin film 30, and the biasing force of compression spring 26 prevents pressure plate 28 from floating up from resin film 30.

Thus, resin film 30 is held cohesively to pressure plate 28. As one example, resin film 30 can be made of silicon rubber, acryl resin with a thin portion functioning as a hinge, or the like.

Moreover, in a portion of flow channel substrate 29 opposed to hole 31 of pressure plate 28, depression 29 a to form internal space 32 is provided, and in the projection position where end portion 23 a of pressing member 23 projects from hole 31 of pressure plate 28, end portion 23 a presses resin film 30 and enters depression 29 a to cause resin film 30 to adhere to a bottom surface of depression 29 a of flow channel substrate 29.

Flow channel substrate 29 has inlet-side flow channel 33 a and outlet-side flow channel 33 b connected to inlet-side flow channel 33 a through internal space 32, and an opening of inlet-side flow channel 33 a and an opening of outlet-side flow channel 33 b are exposed to internal space 32, and both the openings are simultaneously opened and closed by resin film 30.

That is, when resin film 30 is caused to adhere to the bottom surface of depression 29 a of flow channel substrate 29, the opening of inlet-side flow channel 33 a and the opening of outlet-side flow channel 33 b are sealed by resin film 30 to cut off inlet-side flow channel 33 a and outlet-side flow channel 33 b. On the other hand, when the adhesion of resin film 30 to the bottom surface of depression 29 a of flow channel substrate 29 is released, the opening of inlet-side flow channel 33 a and the opening of outlet-side flow channel 33 b are released, so that a fluid can be caused to flow from inlet-side flow channel 33 a to outlet-side flow channel 33 b.

When shape memory alloy wire 21 is not subjected to energization heating, shape memory alloy wire 21 enters the extended state as shown in FIG. 2, and end portion 23 a of pressing member 23 is pushed to resin film 30 by the biasing force of compression spring 26. At this time, resin film 30 is deformed until the resin film 30 comes into contact with the bottom surface of depression 29 a of flow channel substrate 29, so that a volume of internal space 32 surrounded by resin film 30 and flow channel substrate 29 becomes minimal, and the connection between flow channels 33 a, 33 b provided in flow channel substrate 29, and internal space 32 is cut off. On the other hand, when shape memory alloy wire 21 is subjected to energization heating, shape memory alloy wire 21 enters the contracted state against the biasing force of compression spring 26, as shown in FIG. 3, and pressing member 23 is displaced upward in FIG. 3 by a force of shape memory alloy wire 21. End portion 23 a of pressing member 23 is located at the withdrawal position inside hole 31 of pressure plate 28 in accordance with a displacement amount of pressing member 23, and the deformation of resin film 30 is released, thereby releasing the sealing of flow channels 33 a, 33 b by resin film 30. Furthermore, the volume of internal space 32 is increasing, and flow channels 33 a, 33 b and internal space 32 come to connect.

In the case where the driving mechanism shown in FIGS. 2 and 3 is used as micropump 50 a, check valves 52 (refer to dashed line in FIGS. 2 and 3) are provided in both flow channels 33 a, 33 b. For example, when check valves 52 (refer to dashed line in FIGS. 2 and 3) that allow only a flow in a right direction in FIGS. 2 and 3 are provided in both flow channels 33 a, 33 b, the liquid flows from inlet-side flow channel 33 a into internal space 32 in changing from the state in FIG. 2 to the state in FIG. 3, and the liquid flows from internal space 32 to outlet-side flow channel 33 b in changing from the state in FIG. 3 to the state in FIG. 2, so that pump operation is performed.

Moreover, when the driving mechanism shown in FIGS. 2 and 3 is used as microvalve 51 a, the state in FIG. 2 is a valve-closed state where flow channel 33 a and flow channel 33 b are cut off, and the state in FIG. 3 is a valve-opened state where flow channel 33 a and flow channel 33 b are connected.

Micropump 50 a is configured by using shape memory alloy wire 5 a in FIG. 1 and microvalves 51 a are configured by using shape memory alloy wires 9 a, 9 b, 9 c, 9 d, by which fluid conveyance device 1 a functions as the driving device including micropump 50 a and microvalves 51 a.

In the first embodiment, all the driving mechanisms that use shape memory alloy wires 5 a, 9 a, 9 b, 9 c, 9 d to drive micropump 50 a and microvalves 51 a, respectively have the same structure and action. This is desirable in that design is easy and that characteristics do not change even if driven microvalve 51 a is switched.

FIG. 4 shows an outline of microfluidic device 41 a using fluid conveyance device 1 a. As shown in FIG. 4, in microfluidic device 41 a, liquid storage 42 a, micropump 43 a, reactor 44 a, microvalves 45 a to 45 d, detectors 46 a, 46 b, 46 c, and discharger 47 a are connected almost in this order. Only microvalve 45 d is connected to discharger 47 a without going through the detector. Micropump 43 a is configured by micropump 50 a. Microvalves 45 a to 45 d are each configured by microvalve 51 a. Liquid storage 42 a, reactor 44 a, detectors 46 a, 46 b, 46 c, and discharger 47 a are disposed on flow channel substrate 29.

Microfluidic device 41 a sends a liquid stored in liquid storage 42 a provided on flow channel substrate 29 to reactor 44 a by operating micropump 43 a driven by shape memory alloy wire 5 a in a state where only microvalve 45 d driven by shape memory alloy wire 9 d is opened. Opening any one of microvalves 45 a, 45 b, 45 c allows the liquid subjected to reaction processing in reactor 44 a to be sent to any one of the detectors 46 a, 46 b, 46 c by operation of micropump 43 a, in which microvalve 45 a is driven by shape memory alloy wire 9 a, microvalve 45 b is driven by shape memory alloy wire 9 b, and microvalve 45 c is driven by shape memory alloy wire 9 c. Accordingly, three types of determination processing are performed in detectors 46 a, 46 b, 46 c. The liquid passing through detectors 46 a, 46 b, 46 c, and microvalve 45 d is discharged to discharger 47 a.

FIG. 5 shows a timing chart of operation of microfluidic device 41 a.

Microfluidic device 41 a first (in a period from liquid sending start in FIG. 5 to time A, e.g., for 20 seconds) opens microvalve 45 d, and then performs the pump operation which includes suction operation of increasing a volume of micropump 43 a (corresponding to the volume of internal space 32 in FIGS. 2 and 3), and discharge operation of reducing the volume of micropump 43 a. As a result, the liquid is supplied from liquid storage 42 a to reactor 44 a through micropump 43 a, and then, microvalve 45 d is closed.

Next (between times A and B in FIG. 5, e.g., for 5 minutes), the reaction processing is performed in reactor 44 a.

Next (between times B and C in FIG. 5, e.g., for 20 seconds), after microvalve 45 a is opened, the pump operation of micropump 43 a is performed to send the liquid subjected to the reaction processing in reactor 44 a to detector 46 a, and after new liquid is supplied to reactor 44 a from liquid storage 42 a, microvalve 45 a is closed.

Next (between times C and D in FIG. 5, e.g., for 5 minutes), new reaction processing is performed in reactor 44 a, and the determination processing is performed in detector 46 a.

Next (between times D and E in FIG. 5, e.g., for 20 seconds), after microvalve 45 b is opened, the pump operation of micropump 43 a is performed to send the liquid subjected to the reaction processing in reactor 44 a to detector 46 b, and after new liquid is supplied to reactor 44 a from liquid storage 42 a, microvalve 45 b is closed.

Next (between times E and F in FIG. 5, e.g., for 5 minutes), new reaction processing is performed in reactor 44 a, and the determination processing is performed in detector 46 b.

Next (between times F and G in FIG. 5, e.g., for 20 seconds), after microvalve 45 c is opened, the pump operation of micropump 43 a is performed to send the liquid subjected to the reaction processing in reactor 44 a to detector 46 c, and then, microvalve 45 c is closed.

Finally (between times G and H in FIG. 5, e.g., for 1 minute), the determination processing is performed in detector 46 c.

Next, action of this fluid conveyance device 1 a will be described.

In the operation of microfluidic device 41 a in FIG. 5, when micropump 43 a performs the pump operation, any one of microvalves 45 a, 45 b, 45 c, 45 d is necessarily opened. That is, a period when shape memory alloy wire 5 a that drives micropump 43 a is energized is necessarily included in a period when any one of shape memory alloy wires 9 a, 9 b, 9 c, 9 d to drive microvalves 45 a, 45 b, 45 c, 45 d is energized.

FIG. 6 is a timing chart indicating an energization state during driving the micropump and the microvalves.

Valve controller 11 a operates switching circuit 8 a so that the shape memory alloy wire corresponding to the microvalve that is desired to operate among shape memory alloy wires 9 a, 9 b, 9 c, 9 d is energized in accordance with the timing chart in FIG. 5.

Thereafter, switch circuit 3 is turned on and off, by which valve driver 10 a is intermittently energized, and a target one of the microvalves 45 a, 45 b, 45 c, 45 d is opened. With a period between times A and D and a period between times D and G in FIG. 6 each defined as one cycle (e.g., 1 millisecond), valve controller 11 a turns on switch circuit 3 only in a period when only enough average electric power to open the respective microvalves is applied (between times A and C and between times D and F in FIG. 6).

At this time, even in a state where a period when switching circuit 4 a moves to shape memory alloy wire 5 a becomes maximum, it is desirable to turn on switch circuit 3 only in the period when only enough average electric power to open the microvalves is applied, because switch circuit 3 can be operated at constant timing regardless of the state of the micropump.

In this case, if the period when switching circuit 4 a moves to shape memory alloy wire 5 a becomes short, the applied average electric power increases, which raises pressing member 23 from the state in FIG. 3. However, this is not a problem as the operation of the valve. Moreover, as the period when the switching circuit 4 a is connected to shape memory alloy wire 5 a (between times A and B, and between times D and E in FIG. 6) is shorter, the period when switch circuit 3 is turned on (between times A and C, and between times D and F in FIG. 6) is shortened to apply only the average electric power required for opening the microvalve. It is desirable in that unnecessary power consumption can be suppressed.

Pump controller 12 a switches switching circuit 4 a between shape memory alloy wire 5 a and copper wire 6 a in synchronization with the timing when valve controller 11 a operates switch circuit 3. The period when switching circuit 4 a is connected to shape memory alloy wire 5 a (between times A and B, and between times D and E in FIG. 6) is adjusted by pump controller 12 a in accordance with the target pump volume.

In the first embodiment, since all the driving mechanisms using the shape memory alloy wires that drive micropump 50 a and microvalves 51 a have the same structure and action, the electric powers applied to the shape memory alloy wires required for entering the state in FIG. 3 from the state in FIG. 2 are equal.

Accordingly, the maximum time between times A and B and between times D and E in FIG. 6 becomes not longer than time between times A and C, and between times D and F in FIG. 6. Between times A and B and between times D and E in FIG. 6, a voltage applied to both ends of pump driver 7 a becomes substantially half of voltage V of DC power supply 2.

A voltage applied to both ends of valve driver 10 a becomes substantially half of voltage V of DC power supply 2 between times A and B and between times D and E in FIG. 6, and becomes voltage V of DC power supply 2 between times B and C and between E and F in FIG. 6.

When intervals between times A and C and between times D and F in FIG. 6 are each set so as to bring into the state in FIG. 3 at voltage V/2, pressing member 23 rises from the state in FIG. 3 because the voltage becomes V between times B and C and between times E and F in FIG. 6. However, this does not pose a problem as the operation of the valve. On the other hand, since in the period when the voltage becomes V, the average electric power becomes four times as large as that at voltage V/2, valve controller 11 a makes an adjustment so that the intervals between times B and C and between times E and F in FIG. 6 each become ¼, which makes an average electric power energy constant, and maintains the state in FIG. 3.

As one example, when shape memory alloy wires 5 a, 9 a, 9 b, 9 c, 9 d each have a length of 10 mm and a diameter of 150 μm, and when the voltage of DC power supply 2 is 1 V, a duty ratio to apply the electric power equivalent to continuous energization of 0.21 V to shape memory alloy wire 5 a is about 18%, so that a range of the duty ratio that can be used to control the pump volume can become four times without any loss by resistance.

<Effects>

According to the configuration of the first embodiment, only during the energization to any one of shape memory alloy wires 9 a, 9 b, 9 c, 9 d for microvalve driving, shape memory alloy wire 5 a for micropump driving is energized. Therefore, in contrast to microvalves 45 a, 45 b, 45 c, 45 d of on and off operation, during the driving of micropump 43 a requiring volume control, shape memory alloy wire 5 a for micropump operation is driven at the voltage of DC power supply 2 divided by resistances of shape memory alloy wires 9 a, 9 b, 9 c, 9 d for microvalve operation. As a result, the control of the pump volume becomes easy. Moreover, since the voltage dividing is realized by the resistances of shape memory alloy wires 9 a, 9 b, 9 c, 9 d corresponding to driven microvalves 45 a, 45 b, 45 c, 45 d, wasteful loss is not caused. Thus, fluid conveyance device 1 a that easily realizes the control of the pump volume and reduces loss can be attained.

The characteristics of the first embodiment will be described in more detail. In the following description, a method for opening the micropump and the microvalves included in fluid conveyance device 1 a according to the first embodiment will be described. This method includes step (a) and step (b).

(Step (a))

In step (a), fluid conveyance device 1 a according to the first embodiment is prepared as described above. In other words, a user of the fluid conveyance device 1 a gets ready for the fluid conveyance device 1 a.

(Step (b))

In step (b), following steps (b1) and (b2) are repeated.

First, in step (b1), switching circuit 4 a is connected to shape memory alloy wire 5 a, and switching circuit 8 a is connected to shape memory alloy wire 9 a. In this manner, voltage V is applied to shape memory alloy wires 5 a, 9 a connected in series from power supply part 2 for given time. This corresponds to the section between A and B and the section between D and E in FIG. 6. When shape memory alloys 5 a, 9 a have the same resistance, the voltage of ½ V is applied to shape memory alloys 5 a, 9 a.

Next, in step (b2), switching circuit 4 a is connected to copper wire 6 a. Switching circuit 8 a remains connected to shape memory alloy wire 9 a. In this manner, copper wire 6 a and shape memory alloy wire 9 a are electrically connected in series. Voltage V supplied from power supply part 2 is applied only to shape memory alloy wire 9 a without being applied to shape memory alloy wire 5 a. Accordingly, voltage V is applied to shape memory alloy wire 9 a. This corresponds to the section between B and C and the section between E and F.

These steps (b1) and (b2) are repeated.

Since, generally, the shape memory alloy contracts when being heated, the shape memory alloy heated by the application of the voltage contracts. As is clear from the foregoing description and FIG. 6, since more voltage is applied to shape memory alloy wire 9 a than shape memory alloy wire 5 a, microvalve 51 a is first opened, and micropump 50 a is subsequently opened while repeating steps (b1) and (b2). In this manner, the fluid flows in fluid conveyance device 1 a without wastefully losing the voltage. Needless to say, it should be noted that even if micropump 50 a is opened, the fluid does not flow unless microvalve 51 a is opened.

(Steps (b3) and (b4))

In a quiescent time to prevent shape memory alloy wire 9 a from being heated too much, while the reaction is performed in reactor 44 a, or while detection is performed in detectors 46 a, 46 b, 46 c, switch circuit 3 a may be turned off. This corresponds to the section between C and D and the section between F and G in FIG. 6. In this manner, after step (b2), by turning off switch circuit 3 a, a current flowing in pump driver 7 a and valve driver 10 a from power supply part 2 is turned off. This corresponds to time C and time F in FIG. 6. Thereafter, by turning on switch circuit 3 a, the current flowing in pump driver 7 a and valve driver 10 a from power supply part 2 is turned on. This corresponds to time D and time G in FIG. 6.

Generally, the shape memory alloy is extended by being cooled. For this reason, if a state where voltage is not applied is kept, both of micropump 50 a and microvalve 51 a close spontaneously due to the force of the compression spring 26 in FIG. 2.

While in the first embodiment, DC power supply 2, switch circuit 3, pump driver 7 a, and valve driver 10 a are arranged in series in the order in FIG. 1, the present disclosure is not limited thereto, and they may be arranged in series in arbitrary order. Similarly, as to the arrangement in series inside pump driver 7 a or inside valve driver 10 a as well, the arrangement in series in arbitrary order may be employed.

While in the first embodiment, four shape memory alloy wires 9 a, 9 b, 9 c, 9 d for microvalve driving are arranged in parallel, the present disclosure is not limited thereto. A number of the shape memory alloy wires to be switched may be changed in accordance with a number of the microvalves used in the driven fluid device.

While in the first embodiment, the connection between shape memory alloy wire 5 a and copper wire 6 a is switched by switching circuit 4 a, the present disclosure is not limited thereto. The connection to copper wire 6 a may be turned on and off while maintaining the connection to shape memory alloy wire 5 a.

While in the first embodiment, in each of the driving mechanisms using shape memory alloy wires, linear shape memory alloy wire 21 is used, the present disclosure is not limited thereto. A coil-like shape memory alloy wire may be employed.

While in the first embodiment, coil-like compression spring 26 is used to generate the tension in the extended direction in shape memory alloy wire 21, the present disclosure is not limited thereto. Any well-known elastic mechanism bringing about similar actions and effects can be used.

While in the first embodiment, resin film 30 is directly deformed by pressing member 23 driven by shape memory alloy wire 21, the present disclosure is not limited thereto. Resin film 30 may be indirectly deformed through any well-known mechanism. In this case, an operation direction may be inversed to change from operation of normally closing as in the first embodiment to operation of normally opening.

While in the first embodiment, the configuration is such that when the liquid is first sent to reactor 44 a, microvalve 45 d directly connected to discharger 47 a is used, the present disclosure is not limited thereto. The configuration may be such that any one of microvalves 45 a, 45 b, 45 c is opened to first send the liquid to reactor 44 a without using microvalve 45 d.

While in the first embodiment, the operation of micropump 43 a is performed in the same volume change pattern one cycle every time, the present disclosure is not limited thereto. Volume change patterns different in maximum volume or change time may be used, or the pump operation may be performed a plurality of times in accordance with the configuration of the fluid device.

While in the first embodiment, the reaction processing in reactor 44 a and the determination processing in detectors 46 a, 46 b are performed simultaneously, the present disclosure is not limited thereto. After the one is performed, the other may be performed.

While in the first embodiment, all the driving mechanisms using the shape memory alloy wires that drive micropump 50 a and microvalves 51 a have the same structure and action, the present disclosure is not limited thereto. Different driving mechanisms may be used to similarly carry out the driving as long as the configuration is such that the maximum time between times A and B and between times D and E in FIG. 6 becomes not longer than the time between times A and C and between times D and F in FIG. 6 under an actual operating environment.

Second Embodiment <Configuration>

FIG. 7 shows an outline of fluid conveyance device 1 b functioning as one example of a driving device of a micropump and a microvalve in a second embodiment of the present disclosure.

Fluid conveyance device 1 b includes at least pump driver 7 b, valve driver 10 b, valve driver 10 c, a power supply part, a switch part, valve controller 11 b, and pump controller 12 b. In fluid conveyance device 1 b, the power supply part, the switch part, pump driver 7 b, valve driver 10 b, and valve driver 10 c are connected in series.

Fluid conveyance device 1 b is driven by DC power supply 2 as one example of the power supply part. Only when switch circuit 3 as one example of the switch part connected to DC power supply 2 is on, a current flows in fluid conveyance device 1 b. At this time, the current from DC power supply 2 also flows through pump driver 7 b and valve drivers 10 b, 10 c, which are connected to switch circuit 3 in series.

Pump driver 7 b is made up of switching circuit 4 b as one example of a first selector switch, linear shape memory alloy wire 5 b as one example of a first shape memory alloy wire, and copper wire 6 b as one example of a short-circuit wiring part. The current from DC power supply 2 is configured to flow through either of shape memory alloy wire 5 b and copper wire 6 b selected by switching circuit 4 b. It is desirable in view of smaller resistance to use the copper wire as one example of the short-circuit wiring part. However, the present disclosure is not limited thereto, and another conductive material may be used to realize a short circuit of the short-circuit wiring part.

Moreover, valve driver 10 b is made up of switching circuit 8 b as one example of a second selector switch, and linear shape memory alloy wires 9 e, 9 f as examples of second shape memory alloy wires. The current from DC power supply 2 is configured to flow through any one of shape memory alloy wires 9 e, 9 f selected by switching circuit 8 b.

Moreover, valve driver 10 c is made up of switching circuit 8 c as one example of the second selector switch, and linear shape memory alloy wires 9 g, 9 h as examples of the second shape memory alloy wires. The current from DC power supply 2 is configured to flow through any one of shape memory alloy wires 9 g, 9 h selected by switching circuit 8 c.

Shape memory alloy wire 5 b in FIG. 7 is used to configure micropump 50 b, shape memory alloy wires 9 e, 9 f are used to configure microvalves 51 b, and shape memory alloy wires 9 g, 9 h are used to configure microvalves 51 c. Thus, fluid conveyance device 1 b functions as one example of a driving device including micropump 50 b and microvalves 51 b, 51 c.

Valve controller 11 b as one example of a valve controller is configured so as to control operation of switch circuit 3 and switching circuits 8 b, 8 c independently. Moreover, pump controller 12 b as one example of a pump controller is configured so as to control operation of switching circuit 4 b in accordance with an operation state of valve controller 11 b.

Shape memory alloy wire 5 b in FIG. 7 is used to configure micropump 50 b similar to micropump 50 a of the first embodiment, and shape memory alloy wires 9 e, 9 f, 9 g, 9 h are used to configure microvalves 51 b, 51 c similar to microvalves 51 a of the first embodiment. Thus, fluid conveyance device 1 b functions as the driving device including micropump 50 b and microvalves 51 b, 51 c.

In the second embodiment, all the driving mechanisms that use the shape memory alloy wires to drive micropump 50 b and microvalves 51 b, 51 c have the same structure and action. This is desirable in that design is easy, and that characteristics do not change even if the driven microvalve is switched.

FIG. 8 shows an outline of microfluidic device 41 b using fluid conveyance device 1 b. As shown in FIG. 8, in microfluidic device 41 b, liquid storage 42 b, micropump 43 b, first reactor 44 b, microvalves 45 e, 45 f, second reactor 44 c, microvalves 45 g, 45 h, detector 46 d, and discharger 47 b are connected almost in this order. Microvalves 45 f, 45 h are connected to discharger 47 b without going through the detector and the like. Micropump 43 b is configured by micropump 50 b. Microvalves 45 e, 45 f are each configured by microvalve 51 b. Microvalves 45 g, 45 h are each configured by microvalve 51 c. Liquid storage 42 b, first reactor 44 b, second reactor 44 c, detector 46 d, and discharger 47 b are arranged on flow channel substrate 29.

Microfluidic device 41 b operates micropump 43 b driven by shape memory alloy wire 5 b in a state where microvalve 45 f driven by shape memory alloy wire 9 f is opened to send a liquid stored in liquid storage 42 b provided on flow channel substrate 29 to first reactor 44 b. Opening microvalve 45 e and microvalve 45 h allows the liquid subjected to reaction processing in first reactor 44 b to be sent to second reactor 44 c by operation of micropump 43 b, in which microvalve 45 e is driven by shape memory alloy wire 9 e, and microvalve 45 h is driven by shape memory alloy wire 9 h. Opening microvalve 45 e and microvalve 45 g allows the liquid subjected to additional reaction processing in second reactor 44 c to be sent to detector 46 d by the operation of micropump 43 b, in which microvalve 45 g is driven by shape memory alloy wire 9 g. Accordingly, determination processing of the liquid subjected to two types of reaction processing in first reactor 44 b and second reactor 44 c is performed in detector 46 d. The liquid passing through detector 46 d or microvalve 45 f or 45 h is discharged to discharger 47 b.

FIG. 9 shows a timing chart of operation of microfluidic device 41 b.

Microfluidic device 41 b first (in a period from liquid sending start to time A in FIG. 9, e.g., for 20 seconds) opens microvalves 45 f, 45 h, and then performs the pump operation which includes suction operation of increasing a volume of micropump 43 b (corresponding to the volume of internal space 32 in FIGS. 2 and 3), and discharge operation of reducing the volume of micropump 43 b. As a result, the liquid is supplied from liquid storage 42 b to first reactor 44 b through micropump 43 b, and then microvalve 45 f is closed.

Next (between times A and B in FIG. 9, e.g., for 5 minutes), the reaction processing is performed in first reactor 44 b.

Next (between times B and C in FIG. 9, e.g., for 20 seconds), after microvalves 45 e, 45 h are opened, the pump operation of micropump 43 b is performed to send the liquid subjected to the reaction processing in first reactor 44 b to second reactor 44 c, and then microvalves 45 e, 45 h are closed.

Next (between times C and D in FIG. 9, e.g., for 5 minutes), the second reaction processing is performed in second reactor 44 c.

Next (between times D and E in FIG. 9, e.g., for 20 seconds), after microvalves 45 e, 45 g are opened, the pump operation of micropump 43 b is performed to send the liquid subjected to the reaction processing in second reactor 44 c to detector 46 d, and then microvalves 45 e, 45 g are closed.

Next (between times E and F in FIG. 9, e.g., for 1 minute), the determination processing is performed in detector 46 d.

Next, action of this fluid conveyance device 1 b will be described.

In the operation of microfluidic device 41 b in FIG. 9, when micropump 43 b performs the pump operation, the two microvalves, that is, microvalve 45 e or 45 f, and microvalve 45 g or 45 h are necessarily opened. That is, a period when shape memory alloy wire 5 b that drives micropump 43 b is energized is necessarily included in a period when the two shape memory alloy wires, that is, shape memory alloy wire 9 e or 9 f to drive microvalve 45 e or 45 f, shape memory alloy wire 9 g or 9 h to drive microvalve 45 g or 45 h are energized.

FIG. 10 is a timing chart indicating an energization state during driving the micropump and the microvalves.

Valve controller 11 b operates switching circuit 8 b so that the shape memory alloy wire corresponding to the microvalve that is desired to operate of shape memory alloy wires 9 e, 9 f is energized in accordance with the timing chart in FIG. 9, and operates switching circuit 8 c so that the shape memory alloy wire corresponding to the microvalve that is desired to operate of shape memory alloy wires 9 g, 9 h is energized.

Thereafter, switch circuit 3 is turned on and off, by which valve drivers 10 b, 10 c are intermittently energized, and the target two of the microvalve 45 e or 45 f, and microvalve 45 g or 45 h are opened. With a period between times A and D and a period between times D and G in FIG. 10 each defined as one cycle (e.g., 1 millisecond), valve controller 11 b turns on switch circuit 3 only in a period when only enough average electric power to open the respective microvalves is applied (between times A and C and between times D and F in FIG. 10).

At this time, even in a state where a period when switching circuit 4 b moves to shape memory alloy wire 5 b becomes maximum, it is desirable to turn on switch circuit 3 only in the period when only enough average electric power to open the microvalves is applied, because switch circuit 3 can be operated at constant timing regardless of the state of the micropump.

In this case, if the period when switching circuit 4 b moves to shape memory alloy wire 5 b becomes short, the applied average electric power increases, which raises pressing member 23 from the state in FIG. 3. However, this is not a problem as the operation of the valve. Moreover, as the period when the switching circuit 4 b is connected to shape memory alloy wire 5 b (between times A and B, and between times D and E in FIG. 10) is shorter, the period when switch circuit 3 is turned on (between times A and C, and between times D and F in FIG. 10) is shortened to apply only the average electric power required for opening the microvalves. It is desirable in that unnecessary power consumption can be suppressed.

Pump controller 12 b switches switching circuit 4 b between shape memory alloy wire 5 b and copper wire 6 b in synchronization with the timing when valve controller 11 b operates switch circuit 3. The period when switching circuit 4 b is connected to shape memory alloy wire 5 b (between times A and B, and between times D and E in FIG. 10) is adjusted by pump controller 12 b in accordance with the target pump volume. In the second embodiment, since all the driving mechanisms using the shape memory alloy wires that drive micropump 50 b and microvalves 51 b, 51 c have the same structure and action, the electric powers applied to the shape memory alloy wires required for entering the state in FIG. 3 from the state in FIG. 2 are equal.

Accordingly, the maximum time between times A and B and between times D and E in FIG. 10 becomes not longer than time between times A and C, and between times D and F in FIG. 10. Between times A and B and between time D and E in FIG. 10, a voltage applied to both ends of pump driver 7 b becomes substantially ⅓ of voltage V of DC power supply 2.

Voltages applied to both ends of valve drivers 10 b, 10 c each become substantially ⅓ of voltage V of DC power supply 2 between times A and B and between times D and E in FIG. 10, and becomes substantially ⅔ of voltage V of DC power supply 2 between times B and C and between times E and F in FIG. 10. When intervals between times A and C and times D and F in FIG. 10 are each set so as to bring into the state in FIG. 3 at voltage V/3, pressing member 23 rises from the state in FIG. 3 because the voltage becomes V/2 between times B and C and between times E and F in FIG. 10. However, this does not pose a problem as the operation of the valve. On the other hand, since in the period when the voltage becomes V/2, the average electric power becomes 2.25 times as large as that at voltage V/3, valve controller 11 b makes an adjustment so that the intervals between times B and C and between times E and F in FIG. 10 each become 1/2.25, which makes an average electric power energy constant, and maintains the state in FIG. 3.

As one example, when shape memory alloy wires 5 b, 9 e, 9 f, 9 g, 9 h each have a length of 10 mm and a diameter of 150 μm, and when the voltage of DC power supply 2 is 1 V, a duty ratio to apply the electric power equivalent to continuous energization of 0.21 V to shape memory alloy wire 5 b is about 40%, so that a range of the duty ratio that can be used to control the pump volume can become nine times without any loss by the resistance.

<Effects>

According to the configuration of the second embodiment, only during the energization to the two shape memory alloy wires, that is, shape memory alloy wire 9 e or 9 f for microvalve driving, and shape memory alloy wire 9 g or 9 h for microvalve driving, shape memory alloy wire 5 b for micropump driving is energized. Therefore, in contrast to microvalves 45 e, 45 f, 45 g, 45 h of on/off operation, during the driving of micropump 43 b requiring volume control, shape memory alloy wire 5 b for micropump operation is driven at the voltage of DC power supply 2 divided by resistances of shape memory alloy wires 9 e, 9 f, 9 g, 9 h for microvalve operation. As a result, the control of the pump volume becomes easy. Moreover, since the voltage dividing is realized by the resistances of shape memory alloy wires 9 e, 9 f, 9 g, 9 h corresponding to driven microvalves 45 e, 45 f, 45 g, 45 h, wasteful loss is not caused. Thus, fluid conveyance device 1 b that easily realizes the control of the pump volume, and reduces loss can be attained.

The characteristics of the second embodiment will be described in more detail. In the second embodiment, fluid conveyance device 1 b further includes valve driver 10 c, as shown in FIG. 7. Valve driver 10 c is connected to valve driver 10 b in series. Similarly to valve driver 10 b, valve driver 10 c also has the plurality of shape memory alloy wires 9 g, 9 h, a plurality of microvalves 51 c that perform valve operation with extension and contraction of the plurality of shape memory alloy wires 9 g, 9 h, and switching circuit 8 c that brings into a state where either of shape memory alloy wires 9 g, 9 h can be energized.

Pump driver 7 b and valve driver 10 b are the same as pump driver 7 a and valve driver 10 a in the first embodiment, respectively. Accordingly, operation of pump driver 7 b and valve driver 10 b is also the same as the operation of pump driver 7 a and valve driver 10 a in the first embodiment. Thus, operation of valve driver 10 c will be described.

In step (b1) of the second embodiment, shape memory alloy wire 9 g is selected from the plurality of microvalves 51 c through switching circuit 8 c. The voltage supplied from power supply part 2 is applied to selected shape memory alloy wire 9 g for given time. In this manner, selected shape memory alloy wire 9 g is heated. This corresponds to the section between A and B and the section between D and E in FIG. 10.

In step (b2) also, the voltage supplied from power supply part 2 is applied to selected shape memory alloy wire 9 g. In this manner, selected shape memory alloy wire 9 g is heated. This corresponds to the section between B and C and the section between E and F in FIG. 10.

Microvalves 51 b, 51 c are first opened, and micropump 50 b is subsequently opened while steps (b1) and (b2) are repeated. As in the first embodiment, in the second embodiment as well, in this manner, the fluid flows in fluid conveyance device 1 b without wastefully losing the voltage.

While in the second embodiment, DC power supply 2, switch circuit 3, pump driver 7 b, and valve drivers 10 b, 10 c are arranged in series in the order in FIG. 7, the present disclosure is not limited thereto, and they may be arranged in series in arbitrary order. Similarly, as to the arrangement in series inside pump driver 7 b or inside valve drivers 10 b, 10 c as well, the arrangement in series in arbitrary order may be employed.

While in the second embodiment, the two shape memory alloy wires for microvalve driving are arranged in parallel, the present disclosure is not limited thereto. A number of the shape memory alloy wires to be switched may be changed in accordance with a number of the microvalves used in the driven fluid device.

While in the second embodiment, the connection between shape memory alloy wire 5 b and copper wire 6 b is switched by switching circuit 4 b, the present disclosure is not limited thereto. The connection to copper wire 6 b may be turned on and off while maintaining the connection to shape memory alloy wire 5 b.

While in the second embodiment, valve 45 h is opened until time A in FIG. 9, even when valve 45 h can be replaced by valve 45 g, the same operation can be carried out.

While in the second embodiment, the operation of micropump 43 b is performed in the same volume change pattern one cycle every time, the present disclosure is not limited thereto. Volume change patterns different in maximum volume or change time may be used, or the pump operation may be performed a plurality of times in accordance with the configuration of the fluid device.

While in the second embodiment, all the driving mechanisms using the shape memory alloy wires that drive micropump 50 b and microvalves 51 b, 51 c have the same structure and action, the present disclosure is not limited thereto. Different driving mechanisms may be used to similarly carry out the driving as long as the configuration is such that maximum time between times A and B and between times D and E in FIG. 10 becomes not longer than the time between times A and C and between times D and F in FIG. 10 under an actual operating environment.

Third Embodiment <Configuration>

FIG. 11 shows an outline of fluid conveyance device 1 c functioning as one example of a driving device of a micropump and a microvalve in a third embodiment of the present disclosure.

Fluid conveyance device 1 c includes at least pump driver 7 c, valve driver 10 d, a power supply part, a switch part, valve controller 11 c, and pump controller 12 c. In fluid conveyance device 1 c, pump driver 7 c, valve driver 10 d, the power supply part, and the switch part are connected in series.

Fluid conveyance device 1 c is driven by DC power supply 2 as one example of the power supply part. Only when switch circuit 3 as one example of the switch part connected to DC power supply 2 is on, a current flows in fluid conveyance device 1 c. At this time, the current from DC power supply 2 also flows through pump driver 7 c and valve driver 10 d, which are connected to switch circuit 3 in series.

Pump driver 7 c is made up of switching circuit 4 c as one example of a first selector switch, linear shape memory alloy wires 5 c, 5 d as examples of first shape memory alloy wires, and copper wire 6 c as one example of a short-circuit wiring part. A current from DC power supply 2 is configured to flow through any one of shape memory alloy wires 5 c, 5 d and copper wire 6 c selected by switching circuit 4 c. It is desirable in view of smaller resistance to use the copper wire as one example of the short-circuit wiring part. However, the present disclosure is not limited thereto, and another conductive material may be used to realize a short circuit of the short-circuit wiring part.

Moreover, valve driver 10 d is made up of switching circuit 8 d as one example of a second selector switch, and linear shape memory alloy wires 9 i, 9 j as examples of second shape memory alloy wires. The current from DC power supply 2 is configured to flow through either of shape memory alloy wires 9 i, 9 j selected by switching circuit 8 d.

Shape memory alloy wires 5 c, 5 d in FIG. 11 are used to configure micropumps 50 c, and shape memory alloy wires 9 i, 9 j are used to configure microvalves 51 d, by which fluid conveyance device 1 c functions as one example of a driving device including micropumps 50 c and microvalves 51 d.

Valve controller 11 c as one example of a valve controller is configured so as to control operation of switch circuit 3 and switching circuit 8 d independently. Moreover, pump controller 12 c as one example of a pump controller is configured so as to control operation of switching circuit 4 c in accordance with an operation state of valve controller 11 c.

Shape memory alloy wires 5 c, 5 d in FIG. 11 are used to configure micropumps 50 c similar to micropump 50 a of the first embodiment, and shape memory alloy wires 9 i, 9 j are used to configure microvalves 51 d similar to microvalve 51 a of the first embodiment, by which fluid conveyance device 1 c functions as the driving device including micropumps 50 c and microvalves 51 d.

In the third embodiment, all the driving mechanisms that use the shape memory alloy wires to drive micropumps 50 c and microvalves 51 d have the same structure and action. This is desirable in that design is easy, and that characteristics do not change even if the driven microvalve is switched.

FIG. 12 shows an outline of microfluidic device 41 c using fluid conveyance device 1 c. As shown in FIG. 12, in microfluidic device 41 c, liquid storage 42 c, micropumps 43 c, 43 d, reactor 44 d, microvalves 45 i, 45 j, detectors 46 e, and discharger 47 c are connected almost in this order. Microvalve 45 j is connected to discharger 47 c without going through the detector and the like. Micropumps 43 c, 43 d are each configured by micropump 50 c. Microvalves 45 i, 45 j are each configured by microvalve 51 d. Liquid storage 42 c, reactor 44 d, detector 46 e, and discharger 47 c are arranged on flow channel substrate 29.

Microfluidic device 41 c operates micropump 43 c driven by shape memory alloy wire 5 c and micropump 43 d driven by shape memory alloy wire 5 d in a state where microvalve 45 j driven by shape memory alloy wire 9 j is opened to send a liquid stored in liquid storage 42 c provided on flow channel substrate 29 to reactor 44 d. Opening microvalve 45 i driven by shape memory alloy wire 9 i allows the liquid subjected to reaction processing in reactor 44 d to be sent to detector 46 e by operation of micropump 43 c. Accordingly, determination processing is performed in detector 46 e. The liquid passing through detector 46 e or microvalve 45 j is discharged to discharger 47 c.

FIG. 13 shows a timing chart of operation of microfluidic device 41 c.

Microfluidic device 41 c first (in a period from liquid sending start to time A in FIG. 13, e.g., for 20 seconds) opens microvalve 45 j, and then performs the pump operation which includes suction operation of increasing a volume of micropump 43 c (corresponding to the volume of internal space 32 in FIGS. 2 and 3), and discharge operation of reducing the volume of micropump 43 c. As a result, the liquid starts to be supplied from liquid storage 42 c to reactor 44 d through micropump 43 c.

Next (between times A and B in FIG. 13, e.g., for 20 seconds), pump operation is performed, which is made of suction operation of increasing a volume of micropump 43 d (corresponding to the volume of internal space 32 in FIGS. 2 and 3, but a maximum volume is smaller than that of micropump 43 c, e.g., a volume of 1/10), and discharge operation of reducing the volume of micropump 43 d. As a result, a precise amount of liquid is sent to reactor 44 d from liquid storage 42 c through micropump 43 d, and after the liquid is supplied to reactor 44 d in proper quantities, microvalve 45 j is closed.

Next (between times B and C in FIG. 13, e.g., for 5 minutes), the reaction processing is performed in reactor 44 d.

Next (between times C and D in FIG. 13, e.g., for 20 seconds), after microvalve 45 i is opened, the pump operation of micropump 43 c is performed to send the liquid subjected to the reaction processing in reactor 44 d to detector 46 e, and then, microvalve 45 i is closed.

Next (between times D and E in FIG. 13, e.g., for 1 minute), the determination processing is performed in detector 46 e.

Next, action of this fluid conveyance device 1 c will be described.

In the operation of microfluidic device 41 c in FIG. 13, when micropumps 43 c, 43 d perform the pump operation, either of microvalves 45 i and 45 j is necessarily opened. That is, a period when shape memory alloy wire 5 c that drives micropump 43 c or shape memory alloy wire 5 d that drives micropump 43 d is energized is necessarily included in a period when shape memory alloy wire 9 i or 9 j to drive microvalve 45 i or 45 j is energized.

FIG. 14 is a timing chart indicating an energization state during driving the micropumps and the microvalves.

Valve controller 11 c operates switching circuit 8 d so that the shape memory alloy wire corresponding to the microvalve that is desired to operate of shape memory alloy wires 9 i, 9 j is energized in accordance with the timing chart in FIG. 13. Thereafter, switch circuit 3 is turned on and off, by which valve driver 10 d is intermittently energized, and target microvalve 45 i or 45 j is opened.

With a period between times A and D and a period between times D and G in FIG. 14 each defined as one cycle (e.g., 1 millisecond), valve controller 11 c turns on switch circuit 3 only in a period when only enough average electric power to open the respective microvalves is applied (between times A and C and between times D and F in FIG. 14). At this time, even in a state where a period when switching circuit 4 c moves to shape memory alloy wire 5 c or shape memory alloy wire 5 d becomes maximum, it is desirable to turn on switch circuit 3 on only in the period when only enough average electric power to open the microvalves is applied, because switch circuit 3 can be operated at constant timing regardless of the state of the micropumps.

In this case, if a period when switching circuit 4 c moves to shape memory alloy wire 5 c or shape memory alloy wire 5 d becomes short, the applied average electric power increases, which raises pressing member 23 from the state in FIG. 3. However, this is not a problem as the operation of the valve.

Moreover, as the period when switching circuit 4 c is connected to shape memory alloy wire 5 c or shape memory alloy wire 5 d (between times A and B, and between times D and E in FIG. 14) is shorter, the period when switch circuit 3 is turned on (between times A and C, and between times D and F in FIG. 14) is shortened to apply only the average electric power required for opening the microvalves. It is desirable in that unnecessary power consumption can be suppressed.

Pump controller 12 c switches switching circuit 4 c between shape memory alloy wire 5 c or shape memory alloy wire 5 d, and copper wire 6 c in synchronization with the timing when valve controller 11 c operates switch circuit 3. The period when switching circuit 4 c is connected to shape memory alloy wire 5 c or shape memory alloy wire 5 d (between times A and B, and between times D and E in FIG. 14) is adjusted by pump controller 12 c in accordance with the target pump volume.

In the third embodiment, since all the driving mechanisms using the shape memory alloy wires that drive micropumps 50 c and microvalves 51 d have the same structure and action except for the volume of micropump 43 d, the electric powers applied to the shape memory alloy wires required for entering the state in FIG. 3 from the state in FIG. 2 are equal.

Accordingly, maximum time between times A and B and between times D and E in FIG. 14 becomes not longer than time between times A and C, and between times D and F in FIG. 14. Between times A and B and between times D and E in FIG. 14, a voltage applied to both ends of pump driver 7 c becomes substantially half of voltage V of DC power supply 2.

A voltage applied to both ends of valve drivers 10 d becomes substantially half of voltage V of DC power supply 2 between times A and B and between times D and E in FIG. 14, and becomes voltage V of DC power supply 2 between times B and C and between times E and F in FIG. 14. When intervals between times A and C and times D and F in FIG. 14 are each set so as to bring into the state in FIG. 3 at voltage V/2, pressing member 23 rises from the state in FIG. 3, because the voltage becomes V between times B and C and between times E and F in FIG. 14. However, this does not pose a problem as the operation of the valve. On the other hand, since in the period when the voltage becomes V, the average electric power becomes four times as large as that at voltage V/2, valve controller 11 c makes an adjustment so that the intervals between times B and C and between times E and F in FIG. 14 each become ¼, which makes an average electric power energy constant, and maintains the state in FIG. 3.

As one example, when shape memory alloy wires 5 c, 5 d, 9 i, 9 j each have a length of 10 mm and a diameter of 150 μm, and when the voltage of DC power supply 2 is 1 V, a duty ratio to apply the electric power equivalent to continuous energization of 0.21 V to shape memory alloy wire 5 c or shape memory alloy wire 5 d is about 18%, so that a range of the duty ratio that can be used to control the pump volume can become four times without any loss by the resistance.

<Effects>

According to the configuration of the third embodiment, only during the energization to shape memory alloy wire 9 i or 9 j for microvalve driving, shape memory alloy wire 5 c or shape memory alloy wire 5 d for micropump driving is energized. Therefore, in contrast to microvalves 45 i, 45 j of on/off operation, during the driving of micropump 43 c or micropump 43 d requiring volume control, shape memory alloy wire 5 c or shape memory alloy wire 5 d for micropump operation is driven at the voltage of DC power supply 2 divided by resistances of shape memory alloy wires 9 i, 9 j for microvalve operation. As a result, the control of the pump volume becomes easy. Moreover, since the voltage dividing is realized by the resistances of shape memory alloy wires 9 i, 9 j corresponding to driven microvalves 45 i, 45 j, wasteful loss is not caused. Thus, fluid conveyance device 1 c that easily realizes the control of the pump volume and reduces loss can be attained.

The characteristics of the third embodiment will be described in detail. In the third embodiment, pump driver 7 c has the plurality of micropumps 50 c, as shown in FIG. 11. In other words, one micropump 50 c includes shape memory alloy wire 5 c to perform pump operation with extension and contraction of shape memory alloy wire 5 c. Other micropump 50 c includes shape memory alloy wire 5 d to perform pump operation with extension and contraction of shape memory alloy wire 5 d.

Switching circuit 4 c selects any one of shape memory alloy wires 5 c and 5 d, and copper wire 6 c. In step (b1) of the third embodiment, switching circuit 4 c selects either of shape memory alloy wires 5 c, 5 d. In FIG. 11, shape memory alloy wire 5 c is selected. Switching circuit 8 d selects either of shape memory alloy wires 9 i, 9 j. In FIG. 11, shape memory alloy wire 9 i is selected. The voltage supplied from power supply part 2 is applied to shape memory alloy wires 5 c, 9 i selected in this manner for given time. This allows selected shape memory alloy wires 5 c, 9 i to be heated. This corresponds to the section between A and B and the section between D and E in FIG. 14.

Next, in step (b2), switching circuit 4 c is connected to copper wire 6 c. The switching circuit 8 d remained connected to shape memory alloy wire 9 i. In this manner, copper wire 6 c and shape memory alloy wire 9 i are electrically connected in series. Voltage V supplied from power supply part 2 is applied to shape memory alloy wire 9 i without being applied to shape memory alloy wire 5 c. Accordingly, the voltage V is applied to shape memory alloy wire 9 i. This corresponds to the section between B and C and the section between E and F in FIG. 14.

Microvalve 51 d is first opened, and micropump 50 c is subsequently opened while repeating steps (b1) and (b2). In this manner, as in the first embodiment, in the third embodiment as well, the fluid flows in fluid conveyance device 1 c without wastefully losing the voltage.

While in the third embodiment, DC power supply 2, switch circuit 3, pump driver 7 c, and valve driver 10 d are arranged in series in the order in FIG. 11, the present disclosure is not limited thereto, and they may be arranged in series in arbitrary order. Similarly, as to the arrangement in series inside pump driver 7 c or inside valve driver 10 d as well, the arrangement in series in arbitrary order may be employed.

While in the third embodiment, the two shape memory alloy wires for microvalve driving are arranged in parallel, the present disclosure is not limited thereto. A number of the shape memory alloy wires to be switched may be changed in accordance with a number of the microvalves used in the driven fluid device.

While in the third embodiment, the connection between shape memory alloy wire 5 c or shape memory alloy wire 5 d and copper wire 6 c is switched by switching circuit 4 c, the present disclosure is not limited thereto. The connection to copper wire 6 c may be turned on and off while maintaining the connection to shape memory alloy wire 5 c or shape memory alloy wire 5 d.

While in the third embodiment, the operation of micropump 43 c or micropump 43 d is performed in the same volume change pattern one cycle every time, the present disclosure is not limited thereto. Volume change patterns different in maximum volume or change time may be used, or the pump operation may be performed a plurality of times in accordance with the configuration of the fluid device.

While in the third embodiment, all the driving mechanisms using the shape memory alloy wires that drive micropumps 50 c and microvalves 51 d have the same structure and action, the present disclosure is not limited thereto. Different driving mechanisms may be used to similarly carry out the driving as long as the configuration is such that maximum time between times A and B and between times D and E in FIG. 14 becomes not longer than the time between times A and C and between times D and F in FIG. 14 under an actual operating environment.

While in the third embodiment, shape memory alloy wire 5 c, shape memory alloy wire 5 d, and copper wire 6 c arranged in parallel are switched by one switching circuit 4 c, equivalent operation can be realized to similarly carry out the driving even when a configuration is such that a plurality of pump drivers in each of which the shape memory alloy wire and the copper wire arranged in parallel are switched by the switching circuit are arranged in series.

Fourth Embodiment <Configuration>

FIG. 15 shows an outline of fluid conveyance device 1 d functioning as one example of a driving device of a micropump and a microvalve in a fourth embodiment of the present disclosure.

Fluid conveyance device 1 d includes at least pump drivers 7 d, 7 e, valve driver 10 e, a power supply part, a switch part, valve controller 11 d, and pump controller 12 d. In fluid conveyance device 1 d, pump drivers 7 d, 7 e, valve driver 10 d, the power supply part, and the switch part are connected in series.

Fluid conveyance device 1 d is driven by DC power supply 2 as one example of the power supply part. Only when switch circuit 3 as one example of the switch part connected to DC power supply 2 is on, a current flows in fluid conveyance device 1 d. At this time, the current from DC power supply 2 also flows through pump drivers 7 d, 7 e and valve driver 10 e, which are connected to switch circuit 3 in series.

Pump driver 7 d is made up of switching circuit 4 d as one example of a first selector switch, linear shape memory alloy wire 5 e as one example of a first shape memory alloy wire, resistor 13 a as one example of a resistance wiring part, and copper wire 6 d as one example of a short-circuit wiring part. A current from DC power supply 2 is configured to flow through any one of shape memory alloy wire 5 e, resistor 13 a, and copper wire 6 d selected by switching circuit 4 d.

Pump driver 7 e is made up of switching circuit 4 e as one example of the first selector switch, linear shape memory alloy wire 5 f as one example of the first shape memory alloy wire, resistor 13 b as one example of the resistance wiring part, and copper wire 6 e as one example of the short-circuit wiring part. The current from DC power supply 2 is configured to flow through any one of shape memory alloy wire 5 f, resistor 13 b, and copper wire 6 e selected by switching circuit 4 e.

Respective resistance values of resistors 13 a, 13 b are substantially the same as resistance values of shape memory alloy wires 5 e, 5 f. It is desirable in view of smaller resistance to use the copper wires as the examples of the short-circuit wiring parts. However, the present disclosure is not limited thereto, and a short circuit of the short-circuit wiring part may be realized by another conductive material.

Valve driver 10 e is made up of switching circuit 8 e as one example of a second selector switch, and linear shape memory alloy wires 9 k, 9 l as examples of second shape memory alloy wires. The current from DC power supply 2 is configured to flow through either of shape memory alloy wires 9 k, 9 l selected by switching circuit 8 e.

Shape memory alloy wire 5 e in FIG. 15 is used to configure micropump 50 d, shape memory alloy wire 5 f is used to configure micropump 50 e, shape memory alloy wires 9 k, 9 l are used to configure microvalves 51 e, by which fluid conveyance device 1 d functions as one example of a driving device including micropumps 50 d, 50 e and microvalves 51 e.

Valve controller 11 d as one example of a valve controller is configured so as to control operation of switch circuit 3 and switching circuit 8 e independently. Moreover, pump controller 12 d as one example of a pump controller is configured so as to control operation of switching circuit 4 d in accordance with an operation state of valve controller 11 d.

Shape memory alloy wires 5 e, 5 f in FIG. 15 are used to configure micropumps 50 d, 50 e similar to micropump 50 a of the first embodiment, and shape memory alloy wires 9 k, 9 l are used to configure microvalves 51 e similar to microvalve 51 a of the first embodiment, by which fluid conveyance device 1 d functions as one example of the driving device including micropumps 50 d, 50 e and microvalves 51 e.

In the fourth embodiment, all the driving mechanisms that use the shape memory alloy wires to drive micropumps 50 d, 50 e and microvalves 51 e have the same structure and action. This is desirable in that design is easy and that characteristics do not change even if the driven microvalve is switched.

FIG. 16 shows an outline of microfluidic device 41 d using fluid conveyance device 1 d. As shown in FIG. 16, in microfluidic device 41 d, liquid storages 42 d, 42 e, micropumps 43 e, 43 f, mixer 48, reactor 44 e, microvalves 45 k, 45 l, detectors 46 f, and discharger 47 d are connected almost in this order. Microvalve 45 l is connected to discharger 47 d without going through the detector and the like. Micropumps 43 e, 43 f are configured by micropumps 50 d, 50 e, respectively. Microvalves 45 k, 45 l are each configured by microvalve 51 e. Liquid storages 42 d, 42 e, mixer 48, reactor 44 e, detector 46 f, and discharger 47 d are arranged on flow channel substrate 29.

Microfluidic device 41 d operates micropump 43 e driven by shape memory alloy wire 5 e in a state where microvalve 45I driven by shape memory alloy wire 9 l is opened to send a liquid stored in liquid storage 42 d provided on flow channel substrate 29 to reactor 44 e through mixer 48. Moreover, microfluidic device 41 d operates micropump 43 f driven by shape memory alloy wire 5 f in the state where microvalve 45 l is opened to send a liquid stored in liquid storage 42 e provided on flow channel substrate 29 to reactor 44 e through mixer 48. In mixer 48, the liquid sent by micropump 43 e and the liquid sent by micropump 43 f are joined and mixed by diffusion. Opening microvalve 45 k driven by shape memory alloy wire 9 k allows the liquid subjected to reaction processing in reactor 44 e to be sent to detector 46 f by the operation of micropump 43 e. Accordingly, determination processing is performed in detector 46 f. The liquid passing through detector 46 f or microvalve 45 l is discharged to discharger 47 d.

FIG. 17 shows a timing chart of operation of microfluidic device 41 d.

Microfluidic device 41 d first (in a period from liquid sending start to time A in FIG. 17, e.g., for 20 seconds) opens microvalve 45 l, and then performs pump operation which includes suction operation of increasing a volume of micropump 43 e (corresponding to the volume of internal space 32 in FIGS. 2 and 3), and discharge operation of reducing the volume of micropump 43 e. As a result, the liquid starts to be supplied to reactor 44 e from liquid storage 42 d through micropump 43 e and mixer 48.

Next (between times A and B in FIG. 17, e.g., for 20 seconds), pump operation is performed, which is made of suction operation of increasing a volume of micropump 43 f (corresponding to the volume of internal space 32 in FIGS. 2 and 3), and discharge operation of reducing the volume of micropump 43 f, and the liquid is supplied from liquid storage 42 e to reactor 44 e through micropump 43 f and mixer 48.

Next (between times B and C in FIG. 17, e.g., for 20 seconds), the pump operation of micropump 43 e and the pump operation of micropump 43 f are simultaneously performed to supply the mixed liquid of the liquid of liquid storage 42 d and the liquid of liquid storage 42 e to reactor 44 e through mixer 48, and then, microvalve 45 l is closed. At this time, volume change in the pump operation of micropump 43 f is made smaller than volume change in the pump operation of micropump 43 e (e.g., made smaller up to ⅓). This allows the liquid of liquid storage 42 d and the liquid of liquid storage 42 e to be mixed at a different ratio (e.g., 3:1). It is desirable that the individual pump operations are performed before simultaneously performing the pump operation of micropump 43 e and the pump operation of micropump 43 f, because flow channels up to reactor 44 e through mixer 48 are filled with the liquids, which makes the ratio of the supplied mixed liquid stable.

Next (between times C and D in FIG. 17, e.g., for 5 minutes), the reaction processing is performed in reactor 44 e.

Next (between times D and E in FIG. 17, e.g., for 20 seconds), after microvalve 45 k is opened, the pump operation of micropump 43 e is performed to send the liquid subjected to the reaction processing in reactor 44 e to detector 46 f, and then microvalve 45 k is closed.

Next (between times E and F in FIG. 17, e.g., for 1 minute), the determination processing is performed in detector 46 f.

Next, action of this fluid conveyance device 1 d will be described.

In the operation of microfluidic device 41 d in FIG. 17, when micropumps 43 e, 43 f perform the pump operation, either of microvalves 45 k and 45 l is necessarily opened. That is, a period when shape memory alloy wire 5 e that drives micropump 43 e or shape memory alloy wire 5 f that drives micropump 43 f is energized is necessarily included in a period when shape memory alloy wire 9 k or 9I to drive microvalve 45 k or 45 l is energized.

FIG. 18 is a timing chart indicating an energization state during driving the micropumps and the microvalves. This is a timing chart between times B and C in FIG. 17 when two micropumps 43 e, 43 f simultaneously operate.

Up to time A in FIG. 17, by connecting switching circuit 4 e to copper wire 6 e, the timing chart is similar to the timing chart in FIG. 14 in which the only one micropump is used. Moreover, between times A and B in FIG. 17, by connecting switching circuit 4 d to copper wire 6 d, the timing chart is similar to the timing chart in FIG. 14 in which the only one micropump is used. In both the cases, resistors 13 a and 13 b are not used.

In accordance with the timing chart in FIG. 17, valve controller 11 d operates switching circuit 8 e so that the shape memory alloy wire corresponding to the microvalve that is desired to operate of shape memory alloy wires 9 k, 9 l is energized. Thereafter, switch circuit 3 is turned on and off, by which valve driver 10 e is intermittently energized, and target microvalve 45 k or 45 l is opened.

With a period between times A and E and a period between times E and I in FIG. 18 each defined as one cycle (e.g., 1 millisecond), valve controller 11 d turns on switch circuit 3 only in a period when only enough average electric power to open the respective microvalves is applied (between times A and D and between times E and H in FIG. 18). At this time, even in a state where a period when switching circuit 4 d moves to shape memory alloy wire 5 e or a period when switching circuit 4 e moves to shape memory alloy wire 5 f becomes maximum, it is desirable to turn on switch circuit 3 only in the period when only enough average electric power to open the microvalves is applied, because switch circuit 3 can be operated at constant timing regardless of the state of the micropumps.

In this case, if a period when switching circuit 4 d moves to copper wire 6 d or a period when switching circuit 4 e moves to copper wire 6 e becomes long, the applied average electric power increases, which raises pressing member 23 from the state in FIG. 3. However, this is not a problem as the operation of the valve.

Moreover, as the period when switching circuit 4 d is connected to copper wire 6 d or the period when switching circuit 4 e movers to copper wire 6 e (between times C and D, and between times G and H in FIG. 18) is longer, the period when switch circuit 3 is turned on (between times A and D, and between times E and H in FIG. 18) is shortened to apply only the average electric power required for opening the microvalves. It is desirable in that unnecessary power consumption can be suppressed. Pump controller 12 d switches switching circuit 4 e among shape memory alloy wire 5 e, resistor 13 a, and copper wire 6 d, and switches switching circuit 4 f among shape memory alloy wire 5 f, resistor 13 b and copper wire 6 e in synchronization with the timing when valve controller 11 d operates switch circuit 3.

A period when switching circuit 4 d is connected to shape memory alloy wire 5 e (between times A and C and between times E and G in FIG. 18) or a period when switching circuit 4 e is connected to shape memory alloy wire 5 f (between times A and B and between times E and F in FIG. 18) is adjusted by pump controller 12 d in accordance with the target pump volume.

In the fourth embodiment, since the volume change of micropump 43 e is larger than the volume change of micropump 43 f, in the period when switching circuit 4 d is connected to shape memory alloy wire 5 e is longer than the period when switching circuit 4 e is connected to shape memory alloy wire 5 f. Between times B and C and between times F and G in FIG. 18, since shape memory alloy actuator 5 f is not energized and only shape memory alloy wire 5 e is energized, connecting switching circuit 4 e to resistor 13 b prevents fluctuations of the voltage applied to shape memory alloy wire 5 e.

While resistor 13 a is used when operation in which the volume change of micropump 43 f becomes larger than the volume change of micropump 43 e is simultaneously performed, the operation in the timing chart in FIG. 17 does not have the state. Thus, the resistor 13 a may be omitted.

In the fourth embodiment, since all the driving mechanisms using the shape memory alloy wires that drive micropumps 50 d, 50 e and microvalves 51 e have the same structure and action, the electric powers applied to the shape memory alloy wires required for entering the state in FIG. 3 are equal.

Accordingly, maximum time between times A and C and between times E and G in FIG. 18 becomes not longer than time between times A and D, and between times E and H in FIG. 18. Between times A and B and between times E and G in FIG. 18, a voltage applied to both ends of pump drivers 7 d, 7 e becomes substantially ⅓ of voltage V of DC power supply 2. A voltage applied to both ends of valve driver 10 e becomes substantially ⅓ of voltage V of DC power supply 2 between times A and C and between times E and G in FIG. 18, and becomes substantially half of voltage V of DC power supply 2 between times C and D and between G and H in FIG. 18.

When intervals between times A and D and between E and H in FIG. 18 are each set so as to bring into the state in FIG. 3 at voltage V/3, pressing member 23 rises from the state in FIG. 3 because the voltage becomes V/2 between times C and D and between times G and H in FIG. 18. However, this does not pose a problem as the operation of the valves. On the other hand, since in the period when the voltage becomes V/2, the average electric power becomes 2.25 times as large as that at voltage V/3, valve controller 11 d makes an adjustment so that the intervals between times C and D and between times G and H in FIG. 18 each become 1/2.25, which makes an average electric power energy constant, and maintains the state in FIG. 3.

As one example, when shape memory alloy wires 5 e, 5 f, 9 k, 9 l each have a length of 10 mm and a diameter of 150 μm, and when the voltage of DC power supply 2 is 1 V, a duty ratio to apply the electric power equivalent to continuous energization of 0.21 V to shape memory alloy wire 5 e or shape memory alloy wire 5 f is about 18% in the period up to time A in FIG. 17 and between time A and B in FIG. 17, so that a range of the duty ratio that can be used to control the pump volume can become four times without any loss by the resistance. Moreover, between times B and C in FIG. 17, the duty ratio becomes about 40%, so that the range of the duty ratio that can be used to control the pump volume can become nine times with only resistance loss for limited time between times B and C and between times F and G in FIG. 18.

<Effects>

According to the configuration of the fourth embodiment, only during the energization to shape memory alloy wire 9 k or 9 l for microvalve driving, shape memory alloy wire 5 e or shape memory alloy wire 5 f for micropump driving is energized. Therefore, in contrast to microvalves 45 k, 45 l of on/off operation, during the driving of micropump 43 e or micropump 43 f requiring volume control, shape memory alloy wire 5 e or shape memory alloy wire 5 f for micropump operation is driven at the voltage of DC power supply 2 divided by resistances of shape memory alloy wires 9 k, 9 l for microvalve operation. As a result, the control of the pump volume becomes easy. Moreover, since the voltage dividing is realized by resistances of shape memory alloy wires 9 k, 9 l corresponding to driven microvalve 45 k, 45 l, wasteful loss is only partially caused. Thus, fluid conveyance device 1 d that easily realizes the control of the pump volume and reduces loss can be attained.

The characteristics of the fourth embodiment will be described in more detail. In the fourth embodiment, fluid conveyance device 1 d further includes pump driver 7 e, as shown in FIG. 15. Pump driver 7 e is connected to pump driver 7 d in series. Similar to pump driver 7 d, pump driver 7 e has shape memory alloy wire 5 f, micropump 50 e that performs the pump operation with extension and contraction of third shape memory alloy wire 5 f, second wiring part 6 e arranged in parallel to third shape memory alloy wire 5 f, and third switching circuit 4 e that switches between a state where only shape memory alloy wire 5 f is energized and a state where copper wire 6 e is energized.

Pump driver 7 d and valve driver 10 e are the same as pump driver 7 a and valve driver 10 a in the first embodiment, respectively. Accordingly, operation of pump driver 7 d and valve driver 10 e is also the same as the operation of pump driver 7 a and valve driver 10 a in the first embodiment. Thus, operation of pump driver 7 e will be described.

In step (b1), shape memory alloy wire 5 f is selected through switching circuit 4 e to apply the voltage supplied from power supply part 2 to shape memory alloy wire 5 f for given time. In this manner, shape memory alloy wire 5 f is heated. This corresponds to the section between A and B and the section between E and F in FIG. 14.

Pump drivers 7 d, 7 e may further include resistor 13 a and resistor 13 b, respectively. Resistor 13 a is electrically in parallel to shape memory alloy wire 5 e and short-circuit wiring part 6 d. Resistors 13 a, 13 b may be selected through switching circuits 4 d, 4 f. When resistor 13 b is selected, shape memory alloy wire 5 f is not heated. This corresponds to the section between B and C and the section between F and G in FIG. 18.

In step (b2), wiring part 6 e is selected through switching circuit 4 e. This corresponds to the section between C and D and the section between G and H.

Microvalve 51 e is first opened, and micropumps 50 d, 50 e are subsequently opened while repeating steps (b1) and (b2). As in the first embodiment, in the fourth embodiment as well, in this manner, the fluid flows in fluid conveyance device 1 d without wastefully losing the voltage.

While in the fourth embodiment, DC power supply 2, switch circuit 3, pump drivers 7 d, 7 e, and valve driver 10 e are arranged in series in the order in FIG. 15, the present disclosure is not limited thereto, and they may be arranged in series in arbitrary order. Similarly, as to the arrangement in series inside pump drivers 7 d, 7 e or inside valve driver 10 e as well, the arrangement in series in arbitrary order may be employed.

While in the fourth embodiment, the two shape memory alloy wires for microvalve driving are arranged in parallel, the present disclosure is not limited thereto. A number of the shape memory alloy wires to be switched may be changed in accordance with a number of the microvalves used in the driven fluid device.

While in the fourth embodiment, the connection between shape memory alloy wire 5 e or resistor 13 a, and copper wire 6 d is switched by switching circuit 4 d, the present disclosure is not limited thereto. The connection to copper wire 6 d may be turned on and off while maintaining the connection to shape memory alloy wire 5 e or resistor 13 a.

While in the fourth embodiment, the connection between shape memory alloy wire 5 f or resistor 13 b, and copper wire 6 e is switched by switching circuit 4 e, the present disclosure is not limited thereto. The connection to copper wire 6 e may be turned on and off while maintaining the connection to shape memory alloy wire 5 f or resistor 13 b.

While in the fourth embodiment, the operation of micropump 43 e or micropump 43 f is performed in the same volume change pattern one cycle every time, the present disclosure is not limited thereto. Volume change patterns different in maximum volume or change time may be used, or the pump operation may be performed a plurality of times in accordance with the configuration of the fluid device.

While in the fourth embodiment, all the driving mechanisms using the shape memory alloy wires that drive micropumps 50 d, 50 e and microvalves 51 e have the same structure and action, the present disclosure is not limited thereto. Different driving mechanisms may be used to similarly carry out the driving as long as the configuration is such that maximum time between times A and C and between times E and G in FIG. 18 becomes not longer than the time between times A and D and between times E and H in FIG. 18 under an actual operating environment.

The present disclosure is not limited to the above-described embodiments, but can be carried out in various aspects. For example, as a modification of the fourth embodiment, as shown in FIG. 19, resistors 13 a, 13 b may be removed from respective micropumps 50 d, 50 e in FIG. 15, a plurality of pump drivers 7 d, 7 e may be included, and respective pump drivers 7 d, 7 e may be connected in series.

According to the above-described configuration, a driving device of a micropump and a microvalve that easily realizes control of the pump volume and reduces loss can be attained in a state where the plurality of micropumps 50 d, 50 e are constantly driven simultaneously.

Combining the arbitrary embodiments and modifications of the above-described embodiments and modifications, as needed, can exert effects by the respective embodiments and modifications.

The driving device of the micropump and the microvalve, and the microfluidic device using the driving device according to the present disclosure can easily realize the control of the pump displacement and reduce loss, which is useful. Thus, the microfluidic device using the driving device of the micropump and microvalve according to the present disclosure can be used, for example, as a microfluidic device in which a supplied liquid such as blood is sent to a reactor provided on the device to be subjected to thermal or chemical reaction processing, and the liquid after the reaction processing is then sent to a detector provided on the device to determine a result of the reaction, by which the supplied liquid is evaluated. Moreover, in addition to the sending of the liquid in the microfluidic device, the driving device of the micropump and the microvalve, and the microfluidic device using the driving device according to the present disclosure can be applied as a driving device of a compounding device that compounds small amounts of liquids having characteristics such as taste and flagrance, and a microfluidic device using the same.

REFERENCE SINGS LIST

-   -   1 a, 1 b, 1 c, 1 d FLUID CONVEYANCE DEVICE     -   2 DC POWER SUPPLY     -   3 SWITCH CIRCUIT     -   4 a, 4 b, 4 c, 4 d SWITCHING CIRCUIT     -   5 a, 5 b, 5 c, 5 d, 5 e, 5 f SHAPE MEMORY ALLOY WIRE     -   6 a, 6 b, 6 c, 6 d, 6 e COPPER WIRE     -   7 a, 7 b, 7 c, 7 d, 7 e PUMP DRIVER     -   8 a, 8 b, 8 c, 8 d, 8 e SWITCHING CIRCUIT     -   9 a, 9 b, 9 c, 9 d, 9 e, 9 f, 9 g, 9 h, 9 i, 9 j, 9 k, 9 l SHAPE         MEMORY ALLOY WIRE     -   10 a, 10 b, 10 c, 10 d, 10 e VALVE DRIVER     -   11 a, 11 b, 11 c, 11 d VALVE CONTROLLER     -   12 a, 12 b, 12 c, 12 d PUMP CONTROLLER     -   13 a, 13 b RESISTOR     -   21 SHAPE MEMORY ALLOY WIRE     -   22 HOLDING MEMBER     -   23 PRESSING MEMBER     -   23 a END PORTION     -   24 WIRING     -   25 WIRING     -   26 COMPRESSION SPRING     -   27 FIXED PLATE     -   28 PRESSURE PLATE     -   29 FLOW CHANNEL SUBSTRATE     -   29 a DEPRESSION     -   30 RESIN FILM     -   31 HOLE     -   32 INTERNAL SPACE     -   33 a, 33 b FLOW CHANNEL     -   41 a, 41 b, 41 c, 41 d MICROFLUIDIC DEVICE     -   42 a, 42 b, 42 c, 42 d, 42 e LIQUID STORAGE     -   43 a, 43 b, 43 c, 43 d, 43 e, 43 f, 50 a, 50 b, 50 c, 50 d, 50 e         MICROPUMP     -   44 a, 44 b, 44 c, 44 d, 44 e REACTOR     -   45 a, 45 b, 45 c, 45 d, 45 e, 45 f, 45 g, 45 h, 45 i, 45 j, 45         k, 45 l, 51 a, 51 b, 51 c, 51 d, 51 e MICROVALVE     -   46 a, 46 b, 46 c, 46 d, 46 e, 46 f DETECTOR     -   47 a, 47 b, 47 c, 47 d DISCHARGER     -   48 MIXER     -   52 CHECK VALVE 

What is claimed is:
 1. A method for opening a micropump and a microvalve included in a driving device of the micropump and the microvalve, the method comprising: (a) preparing the driving device of the micropump and the microvalve, the driving device comprising: a first pump driver having a first shape memory alloy wire, a first micropump that performs pump operation with extension and contraction of the first shape memory alloy wire, a first wiring part arranged in electrically parallel to the first shape memory alloy wire, and a first selector switch that selects between a state where only the first shape memory alloy wire is electrically energizable and a state where the first wiring part is electrically energizable; a first valve driver having a plurality of second shape memory alloy wires, a plurality of microvalves that perform valve operation with extension and contraction of the respective plurality of second shape memory alloy wires, and a second selector switch that selects one electrically energizable second shape memory alloy wire from among the plurality of the second shape memory alloy wires; a power supply part; a switch part that is connected to the first pump driver and the first valve driver in series, and turns on and off a current flowing through the first pump driver and the first valve driver from the power supply part; a valve controller that controls a state of the second selector switch and frequency of on and off of the switch part; and a pump controller that controls a period when the first selector switch enters the state where only the first shape memory alloy wire is energizable, in a case where the switch part is in an on state, the method comprising: (b) heating the first shape memory alloy wire and the selected one electrically energizable second shape memory alloy wire to open the micropump including the first shape memory alloy wire and to open the microvalve including the selected one electrically energizable second shape memory alloy wire by repeating the following steps (b1) and (b2): (b1) applying a voltage supplied from the power supply part to the first shape memory alloy wire and the one electrically energizable second shape memory alloy wire selected through the first selector switch and the second selector switch for given time, respectively, to heat the first shape memory alloy wire and the selected one electrically energizable second shape memory alloy wire; and (b2) applying the voltage supplied from the power supply part to the wiring part and the one electrically energizable second shape memory alloy wire selected through the first selector switch and the second selector switch, respectively, to heat the selected one electrically energizable second shape memory alloy wire.
 2. The method according to claim 1, wherein the step (b) further comprises: (b3) turning off the switch part after the step (b2) to turn off the current flowing from the power supply part to the first pump driver and the first valve driver; and (b4) turning on the switch part after the step (b3) to turn on the current flowing from the power supply part to the first pump driver and the first valve driver, and in the step (b), the step (b1), the step (b2), the step (b3) and the step (b4) are repeated.
 3. The method according to claim 1, wherein the driving device of the micropump and the microvalve further comprises a second valve driver having a plurality of third shape memory alloy wires, a plurality of microvalves that perform valve operation with extension and contraction of the respective plurality of third shape memory alloy wires, and a third selector switch that selects one electrically energizable third shape memory alloy wire from among the plurality of the third shape memory alloy wires, the second valve driver is connected to the first valve driver in series, in the step (b1), the voltage supplied from the power supply part is applied to the selected one electrically energizable third shape memory alloy wire for given time to heat the selected one electrically energizable third shape memory alloy wire, and in the step (b2) as well, the voltage supplied from the power supply part is applied to the selected one electrically energizable third shape memory alloy wire to heat the selected one electrically energizable third shape memory alloy wire.
 4. The method according to claim 1, wherein the first pump driver further comprises a third shape memory alloy wire arranged in electrically parallel to the first shape memory alloy wire, and a third micropump that performs pump operation with extension and contraction of the third shape memory alloy wire, the first selector switch switches among a state where only the first shape memory alloy wire is energizable, a state where only the third shape memory alloy wire is energizable, and a state where the first wiring part is energizable, and in the step (b1), one of the first shape memory alloy wire and the third shape memory alloy wire is selected through the first selector switch, and the one of the second shape memory alloy wires is selected through the second selector switch to heat the selected shape memory alloy wires by applying the voltage supplied from the power supply part to the selected shape memory alloy wires for given time.
 5. The method according to claim 1, wherein the driving device of the micropump and the microvalve further comprises a second pump driver having a third shape memory alloy wire, a third micropump that performs pump operation with extension and contraction of the third shape memory alloy wire, a second wiring part arranged in electrically parallel to the third shape memory alloy wire, and a third selector switch that switches between a state where only the third shape memory alloy wire is energizable, and a state where the second wiring part is energizable, the second pump driver is connected to the first pump driver in series, in the step (b1), the third shape memory alloy wire is selected through the third selector switch to heat the third shape memory alloy wire by applying the voltage supplied from the power supply part to the third shape memory alloy wire for given time, and in the step (b2), the second wiring part is selected through the third selector switch.
 6. The method according to claim 5, wherein the first pump driver further comprises a resistor arranged in electrically parallel to the first shape memory alloy wire, the first selector switch switches among a state where only the first shape memory alloy wire is energizable, a state where only the resistor is energizable, and a state where the first wiring part is energizable, the step (b1) further comprises the following steps (b11) and (b12): (b11) selecting the first shape memory alloy wire, the one of the second shape memory alloy wires and the third shape memory alloy wire through the first selector switch, the second selector switch, and the third selector switch, respectively, to heat the first to third shape memory alloy wires by applying the voltage supplied from the power supply part to the selected first to third shape memory alloy wires for given time; and (b12) selecting the resistor, the one of the second shape memory alloy wires, and the third shape memory alloy wire through the first selector switch, the second selector switch, and the third selector switch, respectively, to heat the selected second and third shape memory alloy wires by applying the voltage supplied from the power supply part to the selected second and third shape memory alloy wires for given time, and in the step (b2), the first wiring part, the one of the second shape memory alloy wires, and the second wiring part are selected through the first selector switch, the second selector switch, and the third selector switch, respectively, to heat the selected second shape memory alloy wire by applying the voltage supplied from the power supply part to the selected second shape memory alloy wire for given time. 